© iFixit Business | October 11, 2012
iPod Touch 5th generation teardown
Apple's secret release of the 5th Generation iPod Touch yesterday was like a ninja attack: silent, swift, and unexpected. But we always have our spudgers at the ready and we quickly got the Touch to spill its glorious gadget guts.
The recently-released iPhone 5's modular design ranked high on our repairability scale, so we had lofty hopes for the Touch. Our hopes were swiftly dashed, though. With no external screws, the Touch is tough to pry open, and its logic board utilizes two hard-to-manage ribbon cables: the battery, logic board, front camera, speaker, headphone jack, Lightning connector, and home button switch are all soldered onto one cable, while the volume buttons, power button, LED flash, and rear microphone are all attached to another cable. Repair is not impossible, but it's certainly going to be difficult and expensive if one component breaks. These factors combined earned the iPod a 3 out of 10 on our repairability scale (10 is easiest to repair).
© iFixitThe highlights: The 5th Gen iPod Touch has 512 MB of RAM. In case you thought that a quick zap with the heat gun and a gentle pry is all it would take to get into the Touch, think again! There are several clips and adhesive holding this iPod together. Along with a 4-inch (diagonal) screen, a 5-megapixel iSight camera, and 32 GB or 64 GB storage capacity, the new iPod Touch also sports a retractable post for "the loop." With any luck, this loop will prevent the unintentional iPod "drop test" that often results in shattered hopes and screens. How does the 5th Generation iPod Touch stack up to the iPhone 5? Well, literally speaking, they're fairly well matched in terms of size. The new iPod Touch shares the same height (within a ± .01 inch difference) as the iPhone 5. The volume buttons/microphone/LED flash/power button ribbon cable assembly peels easily from the rear case. We've seen this type of design in previous Apple products. The shift to a single ribbon cable is more cost-effective for the manufacturer, but unfortunately it has a negative impact on repairability. Cables connected to the logic board run over the top and connect on the bottom, making it difficult to remove the board or disconnect the cables. In our recent iPhone 5 teardown, we praised Apple for redesigning a stronger home button. We were somewhat disappointed with the weaker, rubber-membrane design of the iPod Touch's home button. The battery inside the Touch is secured with just the right amount of adhesive—and is again soldered to the logic board. This Plain Jane battery provides 3.8 Whr at 3.7 V for a rating of 1030 mAh, a little more than the previous model's 930 mAh.
© iFixitThe iPod Touch finally shows us what's up its sleeve:
- A5 Processor
- Hynix H9TKNNN4KDBRCR 512 MB RAM
- Toshiba THGBX2G8D4JLA01 32 GB NAND flash
- Apple 3381064 dialog power management IC
- Murata 339S0171 Wi-Fi module
- Broadcom BCM 5976 touchscreen controller
- Apple 33831116
- STMicroelectronics AGD32229ESGEK low-power, three-axis gyroscope
- Texas Instruments 27AZ5R1 touchscreen SoC
Ingun's going global; expands in Latin America and Eastern Europe Benjamin Sontag (INGUN Prüfmittel GmbH) gave a short update on expansion plans in Latin America and Eastern Europe.
Yageo to acquire KEMET in a $1.8 billion deal Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.
EVG and DELO partner to expand materials and process capabilities Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.
Osram recommends current takeover offer from ams Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
FlexEnable makes acquisition for flex displays FlexEnable, developer of flexible organic electronics, has purchased Merck's portfolio of high-performance organic thin-film transistor (OTFT) materials.
Sponsored content by EsemdaContract manufacturer Esemda opens new facility in Vilnius and expands EMS The new facility has been built with reserved space for future expansions. As Esemda constantly grows, it is of great importance to be able to rapidly increase production capacity in large volumes.
Samsung’s CPU project ends, layoffs in CA and TX Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
Marvell completes acquisition of Avera Semi Marvell has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GlobalFoundries.
IAR Systems opens office in Taiwan Swedish IAR Systems, a supplier of software tools and services for embedded development, says the company is expanding in Asia with the opening of an office in Taipei, Taiwan.
ZF and Cree partners up to advance the electric drive ZF Friedrichshafen is teaming up with silicon carbide semiconductor specialist Cree, to create industry-leading, highly efficient electric drivelines.
Sponsored content by SourcengineComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
Broadcom completes acquisition of Symantec Enterprise Security business Semiconductor company Broadcom, says that the company has completed its acquisition of the Enterprise Security business of Symantec Corporation
AVX acquires Chengdu OK New Energy AVX Corporation says it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE).
Vesper names new SVP of worldwide sales & business development MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Gigaphoton establishes new company in China Gigaphoton, a manufacturer of light sources used in semiconductor lithography, says it has established and started running the business of a new company – Gigaphoton China Inc. in China.
Sponsored content by NCAB Group Benelux B.V.Failure is not an option for a PCB More than 30% of the Gerbers NCAB Group Benelux B.V. reviews, have problems. However, the PCB are integrated in key end-user product with more and more High Tech PCB. We are here to support you on the new technologies growth to maintain a high reliability and quality. Contact us to review it together.
Prepare, adapt & overcome - how ‘to Brexit’ The looming, but yet unknown, effects of Brexit have forced companies to prepare for whatever may come. But how does one really prepare for unknown consequences?
Acal BFi signs pan-European agreement with Champs Technologies Acal BFi says it has added Champs Technologies to its magnetics portfolio. Acal BFi is a Europe-wide specialist technology supplier and design partner with a specialist portfolio of magnetic cores and inductive components products and services.
POET’s sale of DenseLight Semi to close POET Technologies Inc. announced the sale of its subsidiary, DenseLight Semiconductors Pte. Ltd. to DenseLight Semiconductor Technology (Shanghai) Co. Ltd. is scheduled to close on or before Friday, November 8, 2019.
Odyssey Semiconductor picks up wafer fab Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
Sponsored content by Nordson ASYMTEKStart-to-finish conformal coating with reliability and efficiency Nordson ASYMTEK’s flexible, modular, Panorama™ S-Line delivers conformal coating process control in a space-saving footprint with overlapping line processes that minimize manufacturing floor space. This innovative, patent-pending line layout trims 50% of the line’s length by using the lower compartment in each piece of equipment for functional use. Combined with Nordson ASYMTEK’s global support, this complete conformal coating line delivers quality, product reliability, efficiency, and safety for all your conformal coating applications.
RBVC, Ford and BMW invests in flexible electric circuit start-up Robert Bosch Venture Capital GmbH (RBVC), the venture capital company of the Bosch Group, announces that it has completed a series B follow-on investment in CelLink Corporation.
Alex Davern to step down as CEO of National Instruments NI has announced that Alex Davern will step down as Chief Executive Officer of the company, effective January 31, 2020. The NI Board of Directors has appointed current President and COO, Eric Starkloff, as NI President and CEO, effective February 1, 2020.
RoodMicrotec takes leading role in APPLAUSE A consortium of 31 key players for packaging of electronics, optics and photonics, equipment suppliers and testing experts from 11 countries launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.Load more news