© iFixit Business | August 17, 2012
A scrambled Zenbook UX32VD coming up
Today we tore apart the Zenbook UX32VD, Asus' flagship Ultrabook. And the Zenbook lived up to its name, giving us very little frustration during deconstruction.
Even though it lost by a couple of millimeters in the slimness race against the MacBook Air, the Zenbook more than made up for it with stellar repairability. With an upgradeable RAM slot, swappable 2.5" hard drive, and a battery that can be easily replaced, the Zenbook earned an 8 out of 10 repairability score, easily trumping the soldered-RAM-and-proprietary-SSD MacBook Air's meager 4 points. Even the LCD is completely replaceable, provided you're keen on using a heat gun and exercising a bit of patience. Bottom line? You can have a slim laptop that is repairable. It just can't bear a fruit logo on its display. Despite being a formidable Ultrabook in its own right, the Zenbook UX32VD is often criticized for its thickness. All things considered, the "bulging waistline" of the Zenbook isn't all that considerable. When compared with a MacBook Air, it's only a few millimeters thicker at the spine. © iFixit The stylish aluminum lower case is held in place with twelve T5 Torx screws. The cover itself is not the same quality you'd find in an Apple product, but we applaud Asus' use of non-propriatery screws. The first component to come out is the battery. Point for repairability! The battery is not glued in place, and a person equipped with the right tools can replace it in a matter of minutes. The 7.4 volt, 6520 mAh battery in the UX32VD weighs 280.5 grams, accounting for approximately 20% of the Zenbook's weight. By comparison, the battery in the 13" MacBook Air is approximately 22% of the Air's total weight at 300 grams – pretty much a negligible difference. The Zenbook comes standard with a 500 GB, 5400 RPM 2.5" hard disk drive, in addition to 24 GB of onboard SSD storage. Compared to its rivals, a 5400 RPM HDD seems a bit out of place in a $1,300 laptop. Because fans are responsible for circulating the air through the computer, they are often the component that collects the most dust. Having fans that are easy to access — like in the UX32VD — are important for making a device that is easy to maintain. It appears as though Asus didn't put too much effort into enforcing their warranty. The "void" sticker isn't some fancy disintegrating kind — just a sticker that actually retains a good amount of stickiness even after removal. We're not saying you should defraud companies — just stating fact.
© iFixitElectronic goodies abound
- Intel Core i7-3517U 1.9 GHz processor
- NVIDIA GeForce GT 620M GPU
- Hynix H5TQ2G83CFR 2 GB DDR3 SDRAM
- Hynix H5TQ2G63DFR 1 GB DDR3 video SDRAM
- SanDisk iSSD SDIS5BK 024G 24 GB SSD
- Intel BD82HM76 platform controller hub
- ON Semiconductor NCP3218 synchronous buck controller
- ITE IT8572G
- Fairchild PC78T FDMC7696
- Richtek RT8168B PWM Controller
- Realtek ALC269 audio codec
Cadence to acquire AWR from NI Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Nidec completed acquisition of Roboteq Nidec Corporation has completed the acquisition of 90% ownership of Roboteq Inc., a U.S.-based designer of ultra-low voltage (ULV) drives, from its owners through Nidec Motor Corporation.
Vesper's ZPL technology included in Alexa-enabled headset Acoustic sensors developer, Vesper, has had its proprietary ZeroPower Listening (ZPL) technology certified by Amazon for extended battery and far-field voice interactions. Vesper's piezoelectric MEMS microphones are powering the first hands-free, extended battery life Alexa-enabled headset that uses ZPL technology.
AutoChips & X-FAB launch mass production of China’s first TPMS chipset AutoChips Inc., a Chinese automotive electronics chip design company (and a subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries, has successfully initiated volume production of a Tire Pressure Monitoring System (TPMS) chipset.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
Green light for NXP’s acquisition of Marvell’s wireless connectivity assets NXP Semiconductors N.V. and Marvell have cleared all necessary hurdles and received the required regulatory approvals for NXP’s acquisition of the wireless connectivity portfolio from Marvell.
Murata continues to expand its Okayama operations A production building that had been under construction since October of last year has been completed at Murata’s production subsidiary Okayama Murata Manufacturing, in Setouchi City, Okayama Prefecture.
TowerJazz to maintain its TPSCo majority ownership Israeli semiconductor manufacturer, TowerJazz, says that it will not sell its stake and board control in its joint venture with Panasonic Corp in Japan, following the Japanese company's announcement that it is selling its semiconductor business.
NI invests $40M in expansion of multifunctional facility in Penang National Instruments is planning to expand its operations in Penang, Malaysia with a new investment which will create over 250 new jobs.
Rimac chooses Analog Devices to enable precision battery management Rimac Automobili is planning to incorporate Analog Devices, Inc’s precision battery management system (BMS) integrated circuits (ICs) into Rimac’s BMS.
Silicon Mobility opens subsidiary in Japan Automotive semiconductor company, Silicon Mobility, is opening a new subsidiary in Tokyo, Japan. This subsidiary will provide system integration expertise and support for local customers.
STMicro completes acquisition of SiC wafer specialist Norstel STMicroelectronics has completed the full acquisition of Swedish silicon carbide (SiC) wafer manufacturer Norstel AB.
Sunway Research Institute of North America officially opens RF connectivity solutions provider, Sunway Communication, has officially opened its North American Research Institute (NARI). The new R&D facility is located in the Sorrento Valley technology park of San Diego, close to other leading technology firms.
Data Respons receives contract for next gen communication solution Data Respons have signed a contract of NOK 20 million (EUR 1.97 million) with a Nordic customer within the space, defence and security industry.
Harbour Group acquires SpotSee Holdings SpotSee Holdings and its subsidiaries are now part of the Harbour Group family of companies. Terms of the transaction were not disclosed.
Intel’s looking to sell its connectivity chips businesses The US chipmaker is reportedly looking for potential buyers for its connected home division, a business unit providing gateway solutions to connect devices and appliances.
Panasonic to sell its chip business to Taiwanese company Panasonic Corporation says that it will transfer the semiconductor business – mainly operated by Panasonic Semiconductor Solutions – to Nuvoton Technology, a Taiwan-based semiconductor company under the umbrella of Winbond Electronics group, in a stock and asset transfer agreement.
First Sensor extends collaboration with Canadian expert for machine vision First Sensor is producing image sensors for a new camera family for a Canadian technology leader for industrial visual inspection in the field of machine vision. The project has a term of seven years.
D3 Engineering moving, expanding in NY Empire State Development (ESD), the economic development arm of New York State, has announced that D3 Engineering will move from its current location in Rochester to a new, larger location in Henrietta, New York, along the state’s northwestern border with Lake Ontario.
Kinetic acquires MegaChips’ smart connectivity division Analog and mixed-signal semiconductor company, Kinetic Technologies, has acquired MegaChips Corporation’s Smart Connectivity Division. Terms of the asset transaction were not disclosed.
Entegris unveils China technology center Entegris has opened its china technology center (CTC) in China’s Silicon Valley, Zhangjiang, Shangha
Seattle start-up to see battery tech investment Group14 Technologies announced it will receive USD 18 million in new financing from several leaders in the battery-industry.Load more news