Business | July 13, 2012
Tokyo Electron and imec cooperate on DSA development
Imec and Tokyo Electron (TEL) aim to accelerate their Directed Self-Assembly (DSA) activities at imec’s recent 300 mm fab-compatible DSA process line.
Over the past two years, both companies have been actively engaged in DSA development. Based on promising results achieved on imec’s 300 mm DSA process line, imec and TEL will now expand their focus to explore DSA as a cost-effective and manufacturing viable patterning technique for 2x and beyond technologies. Recent evaluations have demonstrated the feasibility of DSA to enable frequency multiplication through the use of block copolymers. Line features as small as 12.5 nm and 25 nm contact holes have been patterned on 300 mm substrates at imec using pre-patterned lithography followed by DSA. In recent experiments using pre-patterned EUV holes, on wafers processed on TEL’s CLEAN TRACK™ LITHIUS Pro™ coater/developer interfaced to ASML’s NXE:3100, DSA repaired defective features, lowered line edge roughness (LER) and improved critical dimension (CD) uniformity. But for widespread DSA implementation, lower defect levels are required, and DSA needs to be integrated into existing process flows. Imec and TEL are therefore investigating various integration scenarios for line and hole patterning. Furthermore, comprehensive evaluations to understand material and process interactions on CD uniformity, LER and defect levels are planned. Imec and TEL aim at delivering electrical functional devices using DSA. To push the capabilities of DSA beyond lab-scale environments, one of the world first 300 mm fab-compatible DSA process lines all-under-one-roof was recently implemented in imec’s 300 mm clean room fab. In addition to TEL’s especially configured DSA coater/developer managing gallon-sized quantities of block copolymers, and TEL’s dedicated etch system supporting the DSA pattern transfer, imec has the necessary metrology, cleaning and pattern transfer toolsets. To complete the DSA process line and accelerate R&D on DSA at imec, TEL will provide imec with new hardware within the next few months. “With specially configured DSA coater/developer and etch systems at imec, we have the capability to explore DSA as a potential candidate for next-generation patterning technology”, commented Chung Gishi, Executive VP of Tokyo Electron Ltd. “We hope to understand the critical processes necessary to move early stage development into volume production to benefit our customers”. “DSA continues to show much promise as part of the toolbox for advanced sub-20 nm patterning. Our collaboration with Tokyo Electron has enabled us to rapidly implement DSA processing knowledge that has been developed in academia at the group of Prof. Paul Nealey (University of Wisconsin at Madison) into a representative manufacturing environment. We are excited to extend this effort to dedicated newly developed DSA modules. Early access to this equipment allows us to identify and overcome the critical issues to make DSA ready for implementation into the manufacturing processes of our partners.” commented Kurt Ronse, Director Lithography Department at imec.
ASML ships first-generation multibeam inspection system ‘eScan1000’ ASML Holding NV says that it has completed system integration and testing of its first-generation HMI multibeam inspection (MBI) system for 5 nm nodes and beyond.
Cognex takes measures to counter deteriorating market conditions Machine vision technology provider, Cognex Corporation, says it is taking significant steps to reducing expenses due to deteriorating market conditions and to position the company for growth when conditions improve.
Verkotan selects PWC technology from Rohde & Schwarz Test and measurement specialist Rohde & Schwarz has recently introduced the R&S PWC200, the first plane wave converter (PWC) on the market. Verkotan is the first independent test house to choose this technology to test 5G NR FR1 base stations over-the-air (OTA).
Kurt Sievers takes the helm at NXP At its annual general meeting of shareholders, the appointment of Kurt Sievers as the company’s next CEO was overwhelmingly approved.
Excelitas’ Qioptiq subsidiary expands with new plant Excelitas Technologies, a company delivering photonic solutions, sats that its Qioptiq subsidiary held a ground-breaking ceremony last week to mark the beginning of construction for a new factory in Göttingen, Germany.
Farnell adds Sorensen power supplies to its roster Distributor Farnell announces that it has added Sorensen, the premier DC programmable power supply brand from Ametek, to its range of power supplies.
Infineon raises EUR 1 billion following successful share placement Infineon informs that the company placed 55 million new shares, following an accelerated bookbuilding process with institutional investors, under the exclusion of subscription rights. The shares were placed at a price of EUR19.30 per share, meaning that the company managed to raise EUR 1.06 billion.
Skeleton Technologies strengthens management with new COO Skeleton Technologies has appointed Ants Vill, former Vice President of Product, as Chief Operating Officer.
SiPearl chooses Germany for its first international operational subsidiary SiPearl, a designer of the microprocessor for the European exascale supercomputer, is opening its first international subsidiary in Duisburg, in the Ruhr region, Germany, in order to build closer connections with its German partners and future clients.
DELO reports increased revenues despite current pandemic DELO closed the financial year that ended on March 31 with a turnover of EUR 163 million. This is an increase of almost 5% compared to the previous year (EUR 156 million).
China falls far short of its "Made-in-China 2025" goal IC production in China represented 15.7% of its $125 billion IC market in 2019, up only slightly from 15.1% five years earlier in 2014. IC Insights forecasts that this share will increase by 5.0 percentage points to 20.7% in 2024 (one percentage point per year on average).
COVID-19 highlights the gravity of the secondary market for SME Cha Jin-Seok, Chief Financial Officer of SK Hynix, said it best in the company’s Q1 earnings call, “Because of a never experienced pandemic, even basic business activities such as maintaining normal operations and predicting future demand have become challenging tasks.”
GlobalFoundries to implement ITAR at US manufacturing facility GlobalFoundries plans to implement export control security measures at its most advanced manufacturing facility, Fab 8, in Malta, New York.
Rebound Electronics expands in Asia The independent supplier of electronic components says it is investing to increase its market coverage in Asia with the opening of several new offices and setting up a customer service & telesales centre.
Samsung expands foundry capacity with new production line Samsung Electronics says that it plans to boost its foundry capacity at the company's new production line in Pyeongtaek, Korea, to meet growing global demand for extreme ultraviolet (EUV) solutions.
Super Dry Totech expands Long Term Storage Solutions offering The most recent development for Super Dry Totech, is the acquisition of a new building to expand on capacity & to minimise risk by assuring continuity should a disrupting incident occur in one of the facilities.
Ynvisible acquires electrochromic display company rdot Printed electronics specialist, Ynvisible Interactive, announces that it will acquire the printed electrochromic displays business of rdot AB of Gothenburg, Sweden.Load more news
- COVID-19 highlights the gravity of the secondary market for SME
- Rolls-Royce takes heavy hit from COVID-19 – reduces workforce by 9000
- China falls far short of its "Made-in-China 2025" goal
- GlobalFoundries to implement ITAR at US manufacturing facility
- Data Link Solutions to provide MIDS cabinet terminals to US Navy