Business | January 18, 2012
Cache SSD shipments to explode
Cache SSD shipments to explode, driven by Intel ultrabook initiative.
Booming sales of ultrabooks spurred by strong support from Intel will drive explosive growth in the market for cache solid state drives (SSDs) in the coming years, with shipments set to soar more than a hundredfold by the end of 2015, up from less than one million units in 2011. Fueled by rising sales of ultrabooks, shipments of cache SSD units in 2012 are projected to reach 25.7 million units, up from 881,000 units in 2011 when the technology first appeared, according to an IHS iSuppli Storage Space Market Brief from information and analysis provider IHS (NYSE: IHS). Next year, cache SSD shipments will amount to 68.2 million units, on their way to approximately 121.0 million units by 2015. The majority of cache SSD units will find their way into devices known as ultrabooks—the superthin mobile computers launched by chipmaker Intel in 2011—even though non-ultrabook desktops and notebooks also will account for cache SSD use. Of the more than 25 million cache SSDs to be shipped this year, about 22 million units will be present in ultrabooks, up from a mere 500,000 last year. “Intel is continuing to put its eggs into the ultrabook basket, as indicated by its activities at the Consumer Electronics Show (CES) this week,” said Ryan Chien, research associate for memory & storage at IHS. “From the company’s introduction of the Nikiski reference design, to its announcement that more than 60 additional ultrabook designs will enter the market in time for the 2012 holiday season, Intel at CES showed that Ultrabooks have become the centerpiece of its mobile computing strategy. Cache SSDs represent a key part of Intel’s Ultrabook specification, providing performance, convenience and power-savings capabilities that play a key role in defining the platform.” Cache-ing in A cache SSD looks like a regular solid state drive made up entirely of NAND flash. However, a cache SSD is not an independent storage drive and must run alongside a separate hard drive. Essentially an ultrabook requirement, cache SSDs make PCs more responsive, allowing faster boot-up times than hard disk drives. Cache SSDs are also less expensive than solid state drives, making them a more economical means to enhance system performance than by the wholesale replacement of hard disk drives with solid state drives. For instance, the Vertex 2 SSD from California-based OCZ Technology Group with 120 gigabytes costs about $160—the same price as Intel’s 311 Series cache SSD paired with a 500-gigabyte hard disk drive, suggestive of the kind of appeal that cache SSD solutions might offer for today’s price-conscious consumers. Cache SSDs also should prove popular for enterprise notebooks, allowing for more noticeable performance improvements than a top-line microprocessor or additional dynamic random access memory (DRAM). While prices for cache SSDs are still not low enough for widescale mainstream adoption, the next few years will see more pressure coming from ultrabooks, along with even more affordable “smartbooks” that incorporate mobile architectures and low-cost operating systems, IHS believes. A rival to cache SSD is the hybrid hard disk drive, which looks like a regular hard disk drive but uses embedded NAND as a cache on top of the usual DRAM cache. Both cache and hybrid drives have the option to utilize high densities of multilevel-cell (MLC) NAND, but only cache SSDs have an announced roadmap thus far. Being modular, cache SSD solutions also are inherently more robust and scalable when compared to the novel, one-piece nature of hybrid hard disk drives. The hybrid disk drive is an effort spearheaded by giant storage player Seagate Technology, exemplified by its Momentus XT product. While cache SSDs had only a small presence in the storage industry in 2011, their impact in the coming years will become increasingly significant. In particular, the cache drive segment will be the primary reason behind the increased shipment growth of solid state drives, projected to jump to 46 million units this year, up from 17 million in 2011.
Yageo to Acquire KEMET in a $1.8 billion deal Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.
EVG and DELO partner to expand materials and process capabilities Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.
Osram recommends current takeover offer from ams Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
FlexEnable makes acquisition for flex displays FlexEnable, developer of flexible organic electronics, has purchased Merck's portfolio of high-performance organic thin-film transistor (OTFT) materials.
Samsung’s CPU project ends, layoffs in CA and TX Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
Sponsored content by Nordson ASYMTEKStart-to-finish conformal coating with reliability and efficiency Nordson ASYMTEK’s flexible, modular, Panorama™ S-Line delivers conformal coating process control in a space-saving footprint with overlapping line processes that minimize manufacturing floor space. This innovative, patent-pending line layout trims 50% of the line’s length by using the lower compartment in each piece of equipment for functional use. Combined with Nordson ASYMTEK’s global support, this complete conformal coating line delivers quality, product reliability, efficiency, and safety for all your conformal coating applications.
Marvell completes acquisition of Avera Semi Marvell has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GlobalFoundries.
IAR Systems opens office in Taiwan Swedish IAR Systems, a supplier of software tools and services for embedded development, says the company is expanding in Asia with the opening of an office in Taipei, Taiwan.
ZF and Cree partners up to advance the electric drive ZF Friedrichshafen is teaming up with silicon carbide semiconductor specialist Cree, to create industry-leading, highly efficient electric drivelines.
Broadcom completes acquisition of Symantec Enterprise Security business Semiconductor company Broadcom, says that the company has completed its acquisition of the Enterprise Security business of Symantec Corporation
Sponsored content by SourcengineComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
AVX acquires Chengdu OK New Energy AVX Corporation says it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE).
Vesper names new SVP of worldwide sales & business development MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Gigaphoton establishes new company in China Gigaphoton, a manufacturer of light sources used in semiconductor lithography, says it has established and started running the business of a new company – Gigaphoton China Inc. in China.
Prepare, adapt & overcome - how ‘to Brexit’ The looming, but yet unknown, effects of Brexit have forced companies to prepare for whatever may come. But how does one really prepare for unknown consequences?
Sponsored content by NCAB Group Benelux B.V.Failure is not an option for a PCB More than 30% of the Gerbers NCAB Group Benelux B.V. reviews, have problems. However, the PCB are integrated in key end-user product with more and more High Tech PCB. We are here to support you on the new technologies growth to maintain a high reliability and quality. Contact us to review it together.
Acal BFi signs pan-European agreement with Champs Technologies Acal BFi says it has added Champs Technologies to its magnetics portfolio. Acal BFi is a Europe-wide specialist technology supplier and design partner with a specialist portfolio of magnetic cores and inductive components products and services.
POET’s sale of DenseLight Semi to close POET Technologies Inc. announced the sale of its subsidiary, DenseLight Semiconductors Pte. Ltd. to DenseLight Semiconductor Technology (Shanghai) Co. Ltd. is scheduled to close on or before Friday, November 8, 2019.
Odyssey Semiconductor picks up wafer fab Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
RBVC, Ford and BMW invests in flexible electric circuit start-up Robert Bosch Venture Capital GmbH (RBVC), the venture capital company of the Bosch Group, announces that it has completed a series B follow-on investment in CelLink Corporation.
Sponsored content by EsemdaContract manufacturer Esemda opens new facility in Vilnius and expands EMS The new facility has been built with reserved space for future expansions. As Esemda constantly grows, it is of great importance to be able to rapidly increase production capacity in large volumes.
Alex Davern to step down as CEO of National Instruments NI has announced that Alex Davern will step down as Chief Executive Officer of the company, effective January 31, 2020. The NI Board of Directors has appointed current President and COO, Eric Starkloff, as NI President and CEO, effective February 1, 2020.
RoodMicrotec takes leading role in APPLAUSE A consortium of 31 key players for packaging of electronics, optics and photonics, equipment suppliers and testing experts from 11 countries launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.
Nidec provides an update on its Omron deal Nidec Corporation previously announced a plan to acquire Omron Automotive Electronics from Omron Corporation back inn April, 2019.Load more news