Business | November 04, 2011
Thailand Flood impacts Semi Test & Assembly operations of multiple suppliers
Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster.
Although the worst of the flooding has passed, the catastrophe has upset production at some of these facilities, which may require customers of these specific companies to adjust their supply strategies. However, the impact is not significant enough to have a measurable effect on overall semiconductor industry revenue growth. Semiconductor suppliers whose test and assembly operations have been affected include ON Semiconductor, ROHM Semiconductor, Lapis Semiconductor, Hana Semiconductor, Stars Microelectronics, Vigilant Technology, STATS ChipPac and Toshiba. Other companies operating test and assembly facilities in the nation have not yet suffered any direct impact from the disaster, including Microchip, Maxim Integrated Products, NXP, Spansion and UTAC. However, some of these companies have encountered indirect impacts due to disaster-related disruptions among their suppliers. Outside of the semiconductor makers, at least one supplier of a key component used for semiconductor assembly has been impacted: Sumitomo Thailand, a maker of lead frames. ON Semiconductor’s Thailand semiconductor assembly and test facility has been impacted by the flooding. The majority of the products shipped from this facility serve the Japanese market. ON is in the process of relocating its production to other sites. ROHM’s sole facility in Thailand has been closed since Oct. 19. The facility conducts assembly and test for integrated circuits, discrete transistors, diodes, resistors and tantalum capacitors. ROHM is attempting to shift production to other locations. Lapis’ operation, which is located in one of the most flooded areas—Rojana Industrial Park—now is closed. Lapis is looking to supply product from alternative locations. The Thailand facility of Hana Semiconductor, a subcontractor for Microchip, Texas Instruments (TI) and others, is currently submerged. Until the water recedes, no assessment can be made as to the length of time that the facility will remain inoperative. TI and Microchip are relocating as much production as possible to other qualified locations. The Ayutthaya facility of Stars Microelectronics has been flooded. A subcontractor for Microchip, Stars is relocating operations to other sites and anticipates that the impact on production of Microchip’s wireless modules will be minimal. Vigilant Technology has shut down its Thailand facility, although it has suffered no flooding at this time. Vigilant is a supplier of mature low pin-count and power semiconductor packages. STATS ChipPac has suspended operations at its Thailand location, which accounts for less than 10 percent of STATS revenue. The company is relocating assembly and test operations to other facilities and expects minimal impact on its customers. Operations in Thailand have been stopped since Oct. 12 at Toshiba Semiconductor for assembly of LEDs and discrete chips. The operation is located at Bangkadi Industrial Park. Sumitomo Thailand has stopped supplying lead frames from its Thailand facility to TI. However, Sumitomo has other operations and is shifting demand to other locations. The impact on Texas Instruments is currently expected to be minimal, and TI already has indicated that there will be no shortages in the fourth quarter. Lead frames serve as the supporting structure of semiconductors, playing a key role in the assembly process.
Ingun's going global; expands in Latin America and Eastern Europe Benjamin Sontag (INGUN Prüfmittel GmbH) gave a short update on expansion plans in Latin America and Eastern Europe.
Yageo to acquire KEMET in a $1.8 billion deal Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.
EVG and DELO partner to expand materials and process capabilities Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.
Osram recommends current takeover offer from ams Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
Sponsored content by Nordson ASYMTEKStart-to-finish conformal coating with reliability and efficiency Nordson ASYMTEK’s flexible, modular, Panorama™ S-Line delivers conformal coating process control in a space-saving footprint with overlapping line processes that minimize manufacturing floor space. This innovative, patent-pending line layout trims 50% of the line’s length by using the lower compartment in each piece of equipment for functional use. Combined with Nordson ASYMTEK’s global support, this complete conformal coating line delivers quality, product reliability, efficiency, and safety for all your conformal coating applications.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
FlexEnable makes acquisition for flex displays FlexEnable, developer of flexible organic electronics, has purchased Merck's portfolio of high-performance organic thin-film transistor (OTFT) materials.
Sponsored content by NCAB Group Benelux B.V.Failure is not an option for a PCB More than 30% of the Gerbers NCAB Group Benelux B.V. reviews, have problems. However, the PCB are integrated in key end-user product with more and more High Tech PCB. We are here to support you on the new technologies growth to maintain a high reliability and quality. Contact us to review it together.
Samsung’s CPU project ends, layoffs in CA and TX Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
Marvell completes acquisition of Avera Semi Marvell has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GlobalFoundries.
IAR Systems opens office in Taiwan Swedish IAR Systems, a supplier of software tools and services for embedded development, says the company is expanding in Asia with the opening of an office in Taipei, Taiwan.
ZF and Cree partners up to advance the electric drive ZF Friedrichshafen is teaming up with silicon carbide semiconductor specialist Cree, to create industry-leading, highly efficient electric drivelines.
Broadcom completes acquisition of Symantec Enterprise Security business Semiconductor company Broadcom, says that the company has completed its acquisition of the Enterprise Security business of Symantec Corporation
AVX acquires Chengdu OK New Energy AVX Corporation says it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE).
Vesper names new SVP of worldwide sales & business development MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Gigaphoton establishes new company in China Gigaphoton, a manufacturer of light sources used in semiconductor lithography, says it has established and started running the business of a new company – Gigaphoton China Inc. in China.
Sponsored content by SourcengineComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
Prepare, adapt & overcome - how ‘to Brexit’ The looming, but yet unknown, effects of Brexit have forced companies to prepare for whatever may come. But how does one really prepare for unknown consequences?
Acal BFi signs pan-European agreement with Champs Technologies Acal BFi says it has added Champs Technologies to its magnetics portfolio. Acal BFi is a Europe-wide specialist technology supplier and design partner with a specialist portfolio of magnetic cores and inductive components products and services.
POET’s sale of DenseLight Semi to close POET Technologies Inc. announced the sale of its subsidiary, DenseLight Semiconductors Pte. Ltd. to DenseLight Semiconductor Technology (Shanghai) Co. Ltd. is scheduled to close on or before Friday, November 8, 2019.
Odyssey Semiconductor picks up wafer fab Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
Sponsored content by EsemdaContract manufacturer Esemda opens new facility in Vilnius and expands EMS The new facility has been built with reserved space for future expansions. As Esemda constantly grows, it is of great importance to be able to rapidly increase production capacity in large volumes.
RBVC, Ford and BMW invests in flexible electric circuit start-up Robert Bosch Venture Capital GmbH (RBVC), the venture capital company of the Bosch Group, announces that it has completed a series B follow-on investment in CelLink Corporation.
Alex Davern to step down as CEO of National Instruments NI has announced that Alex Davern will step down as Chief Executive Officer of the company, effective January 31, 2020. The NI Board of Directors has appointed current President and COO, Eric Starkloff, as NI President and CEO, effective February 1, 2020.
RoodMicrotec takes leading role in APPLAUSE A consortium of 31 key players for packaging of electronics, optics and photonics, equipment suppliers and testing experts from 11 countries launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.Load more news