Program

• 09:00 - 09:30
  Startups Survival Guide
  David Sandys - Director, Business Ecosystem Development - Digi-Key Electronics
• 09:35 - 10:05
  TBA
  Aegis Software
• 10:10 - 10:40
  AMB Openair Plasma technology in electronic production processes
  AMB Technic
  In our presentation we will focus on the impact of plasma on surfaces and we will introduce PlasmaPlus coating technology. In addition, we give examples of plasma in electronic production (conforrmal coating, optical bonding, sealing).
• 10:45 - 11:45
  What's in silicon? - MPUs in Microchip's line-up
  Artur Malek - District Sales Manager - Microchip
  Efficient and secure application processors in the "System on Chip" and "System on Module" options in the Microchip's product portfolio. Architecture, peripherals, programming environment (MPLAB, Eclipse, QT) and support for Embedded Linux.
• 11:50 - 12:20
  Artificial Intelligence meets Real World - AI-based PCBA optical inspection
  Grzegorz Kałucki - Artificial Intelligence Specialist - Fitech (grupa Fideltronik)
  Nowadays it's hard to find someone who has not heard about the Artificial Intelligence. The term is still thrown around in various contexts as an universal remedy, meant to instantenously and effortlessly solve complex problems in which the classical algorithms fail miserably. Sadly, this stance could not be further from the truth. As a team that has been working on AI-based automatic optical inspection for PCBA assembly for the past few years, we will reveal just a bit of the messiness and unpredictability behind it. In this talk we will present our entire journey from the first prototype to a working, scalable, robust solution. We will show the effort it takes to transform a raw neural network output into a valuable, user-friendly information, the importance of infrastructure and short feedback loops, as well as how to properly handle ad-hoc requests.
• 12:35 - 13:05
  Electromagnetic Simulation: Reality or Science Fiction
  Tomasz Kądziołka - Mesco
  Computer simulation allows engineers to get to know their products better and supports work on new projects. The simulation allows better understanding of the phenomena that can accompany, e.g. current flow: the phenomenon of displacement, approximation or changes in the conductivity of a material under the influence of temperature. Only computer simulation allows making informed design decisions. During the presentation, practical examples of calculation will be presented combining, among others simulations of electromagnetic phenomena with thermics and mechanics.
• 13:10 - 13:40
  A simulation for PCB without models for PCB designers
  Tomasz Górecki - Manager Eastern Europe - FlowCAD
  Cadence has introduced a simulation for PCB without models for PCB designers. Many problems in designs today are coming from impedance discontinuity, crosstalk and voltage drops. These simulations are now integrated into PCB Editor and provide easy to understand results in seconds. This helps to avoid 80% of SI and PI problems already in the design process.
• 13:45 - 14:15
  5G Demystification
  Jean Louis Mendes - BDM RF&Microwave Solutions Business Unit - Molex
  For over two years, the entire IT industry, in particular telecommunications, has been working to develop and implement the 5G network. In the entire history of telecommunications, there has not been a situation where so much emphasis has been placed on the introduction of new technology, as is the case with 5G. It is important to remember that for the 5G revolution to become a reality, it is necessary to develop new technologies, both in terms of hardware and software. How are these technological changes taking place and why are they so important that we can start using the 5G network?
• 14:20 - 14:50
  Effective heat dissipation: property comparison dosed Gap Fillers with thermal pads
  Barbara Ligenza - BL Elektronik
  The most commonly chosen thermally conductive materials are ready thermal pads of the required thickness, cut to a specific shape. This solution has a great advantage, is easy to use and does not require investment in tooling. However, in mass production, applying pads is too time consuming. Automotive electronics, energy-saving lighting and other sectors require increasingly higher production efficiency, and reduced mechanical pressure on components, hence the growing demand for thermal metered materials. Dosing Gap Fillers require automation of the production process and investment in dosing machines along with the application system.
• 14:55 - 15:25
  tba
  Jacek Marcinkowski - Project Manager - Unisystem
• 15:30 - 16:00
  IoT and cloud system architecture and security
  Computer Controls
  Discussion of sample IoT and cloud system architectures and analysis of potential threats with specific security solutions.