The conference program run parallel with the Expo. Free to visit any of the sessions when you register for Evertiq Expo. Lunch will be served 11:00-13:00.

• 09:00 - 09:30
  Revolutionizing the World of Manufacturing
  Arkadiusz Rataj - Sales Manager - Digi-Key Electronics
  In 1913, Henry Ford introduced the first assembly line. Prior to the introduction of the assembly line, an automobile took an average of 12 hours to build. The moving assembly line drastically cut that to just over an hour and a half from start to finish. In doing this, Ford was able to mass-produce the Model T as well as cut costs for the public. Today, cars are far more complex than that of the Model T. Necessity breeds innovation. In 1961, Robotics were introduced onto the factory floor by General Motors. Today, robotics can be found throughout the entire manufacturing process. With the support of IoT, we are now able to do far more than ever before with automated manufacturing.
• 09:35 - 10:05
  Spare Parts, risk or necessity? Based on the Alliance Memory example.
  Grzegorz Skruch - Product Manager - CBTG Technologie
  The current situation on semiconductor market forces manufaturers to look for spare parts. In addition to the unavailability of parts, their price also increases, which additionally motivates design changes. In the past, R&D departments approached all changes with great reserve, we often met with the answer "Better is the enemy of good". In present, it is a necessity focused at securing the continuity of production. Meeting the expectations of our clients and ensuring the full support of our team, we help to find alternatives that do not require costly design changes while maintaining availability and cost optimization. Great example are Alliance Memory chips, which can replace other manufacturer chips in most of situations as an identical part.
• 10:10 - 10:40
  Increase yield and maximize efficiency by depaneling with the laser
  Patrick Stockbrügger - Product Manager - ElectronicsQuipment LPKF Laser & Electronics AG
  Marek Zduńczuk - Managing Director - SE Spezial-Electronic Polen Sp. z.o.o.
  In the production of electronic assemblies, depaneling is often regarded as a necessary evil and in some cases as a non-value-adding process. The depaneling process always takes place at the end of the production line, the assemblies are actually finished and now only have to be separated from the panel somehow. The methods of depaneling known in many places for this purpose are predominantly mechanical. The laser, as an alternative tool for depaneling, is not yet widely used throughout Europe. The prevailing opinion is that the laser is expensive, complicated to operate and program, and that the laser process would damage the material. That this view is no longer up-to-date is shown by the resounding success of the laser on the Asian market over the past few years and the now also strongly growing demand on the European market. Here, experience has shown that the laser is ideally suited for the depaneling process. Above all, due to its gentle processing, which, together with its process stability and precision, ensures a significant increase in yield. But modern laser concepts can also impress with further advantages: low running costs, material efficiency and environmental protection, long durability, maximum flexibility and a high degree of automation.
• 10:45 - 11:15
  Decentralized management as a cornerstone in Incap's success
  Otto Pukk - CEO - Incap Corporation
  Incap operates in a decentralized way driven by the customers and their needs. The strong entrepreneurial drive translates into faster decisions making, responsibility and shortens the time-to-market for the customers. This adds true value to Incap's customers, employees and investors, and is a cornerstone in Incap' s success story.
• 11:20 - 11:50
  De-overseas your business: the benefits of local production in a globalized distribution chain
  Jakub Klama - Member of the Board; Chief Executive Officer - Conclusive Engineering Sp. z o.o.
  Wojciech Kloska - Member of the Board; Chief Technical Officer - Conclusive Engineering Sp. z o.o.
  Full turnkey embedded hardware development pipeline without overseas contractors - is this even viable? For many decades now, in search of lower costs, businesses in the hardware manufacturing sector were outsourcing product manufacturing overseas. We decided against it. And it turns out the benefits are hard to ignore. Increased agility, faster product turnover, extreme customization capabilities of both software and hardware. All this within a single legal framework to ensure maximum security of the product during manufacture, IP protection, lack of unenforceable international contracts and disruptions caused by stormy political weather. We believe this is the future of hardware production - bringing your facilities local is our industry's equivalent of edge computing. This requires adapting your business from the ground up, including the portfolio. We'll talk about how to weave your services and products together to build a lasting, resilient local hardware company.
• 11:55 - 12:25
  The trade-off between cost, scope and speed - software solutions for EMS companies
  Dirk Stender - Sales Director - CalcuQuote
  Now more than ever, EMS companies are facing increased pressure from their customers to meet unprecedented demands. Their customers are demanding lower costs, increased scope of services and faster turn times. Margins are already tight in the EMS industry, companies have to find more efficient methods for delivering higher productivity, while improving quality levels. The question we will be exploring is how EMS companies can use modern software technology and digital supply chains to meet increasing requirements.
• 12:35 - 13:05
  Electromagnetic Simulation: Reality or Science Fiction
  Tomasz Kądziołka - Mesco
  Computer simulation allows engineers to get to know their products better and supports work on new projects. The simulation allows better understanding of the phenomena that can accompany, e.g. current flow: the phenomenon of displacement, approximation or changes in the conductivity of a material under the influence of temperature. Only computer simulation allows making informed design decisions. During the presentation, practical examples of calculation will be presented combining, among others simulations of electromagnetic phenomena with thermics and mechanics.
• 13:10 - 13:40
  How 5G will change wireless communication:
  Björn Glückstadt - Sales Engineer - Cradlepoint Central Europe - Balticad
  * Cradlepoint - Introducing the new 5G communication leader in Europe. * Overview of available 5G solutions for IoT, Mobile and Branch Office applications * How 5G technology will affects your business. Discussion on selected examples.
• 13:45 - 14:15
  5G Demystification
  Jean Louis Mendes - BDM RF&Microwave Solutions Business Unit - Molex
  For over two years, the entire IT industry, in particular telecommunications, has been working to develop and implement the 5G network. In the entire history of telecommunications, there has not been a situation where so much emphasis has been placed on the introduction of new technology, as is the case with 5G. It is important to remember that for the 5G revolution to become a reality, it is necessary to develop new technologies, both in terms of hardware and software. How are these technological changes taking place and why are they so important that we can start using the 5G network?
• 14:20 - 14:50
  Effective heat dissipation: property comparison dosed Gap Fillers with thermal pads
  Barbara Ligenza - BL Elektronik
  The most commonly chosen thermally conductive materials are ready thermal pads of the required thickness, cut to a specific shape. This solution has a great advantage, is easy to use and does not require investment in tooling. However, in mass production, applying pads is too time consuming. Automotive electronics, energy-saving lighting and other sectors require increasingly higher production efficiency, and reduced mechanical pressure on components, hence the growing demand for thermal metered materials. Dosing Gap Fillers require automation of the production process and investment in dosing machines along with the application system.
• 14:55 - 15:25
  Artificial Intelligence meets Real World - AI-based PCBA optical inspection
  Grzegorz Kałucki - Artificial Intelligence Specialist - Fitech
  Kamil Jarosz - Artificial Intelligence Specialist - Fitech
  Nowadays it is hard to find someone who has not heard about the Artificial Intelligence. The term is still thrown around in various contexts as an universal remedy, meant to instantaneously and effortlessly solve complex problems in which the classical algorithms fail miserably. Sadly, this stance could not be further from the truth. As a team that has been working on AI-based automatic optical inspection for PCBA assembly for the past few years, we will reveal just a bit of the messiness and unpredictability behind it. In this talk we will present our entire journey from the first prototype to a working, scalable, robust solution. We will show the effort it takes to transform a raw neural network output into a valuable, user-friendly information and the importance of short feedback loops and incremental approach with verifiable steps.
• 15:30 - 16:00
  IoT and cloud system architecture and security
  Kamil Prus - Busines Development Manager / FAE Poland - Computer Controls
  Discussion of sample IoT and cloud system architectures and analysis of potential threats with specific security solutions.