This new family of systems incorporates new 3-D inspection technology. The new Zenith system is based on technology which incorporates the ability to sense and measure the Z-axis profilometry of whole assembled PCB surfaces, including electronic components, solder joints, patterns, holes and even components with foreign material on them. The Zenith's 3-D capability operates in addition to full conventional 2-D AOI; thus, Zenith eliminates the traditional shortcomings of 2-D AOI which make it vulnerable to in escapes, false calls and inspection errors.

The new Zenith system also combines 3-D measurement with 2-D AOI technology. The ability to measure the height and shape of components and shiny solder joints allows a true comparison with the IPC 610 Acceptability Standard. Thus, there is no question regarding the acceptability of the solder joint.