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SMT & Inspection | December 27, 2007

SUSS raise € 9.0 million

Germany based SUSS MicroTec has announced the placement of a EUR 9.0 million promissory note bond (Schuldscheindarlehen).
The bond, placed under the leadership of UniCredit (HVB), has a five-year term and will serve to refinance short-term liabilities and fund medium to long-term corporate and investment requirements.

The unsecured bond places SUSS MicroTec’s funding structure on a wider base. At the same time the company benefits from the attractive current interest rate levels. The promissory note bond’s terms reflect SUSS MicroTec AG’s good credit standing.

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