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SMT & Inspection | September 14, 2004

Dow Corning, INVINT team on Interconnect Technology

Dow Corning Corporation has signed a joint development contract with Scotland's INVINT Limited, supplier of conductive polymer interconnect technology.
The agreement is expected to lead to the development of a variety of new interconnect technologies for the global electronics industry. Under the contract, INVINT will develop and characterize novel interconnect processes based on new Dow Corning conductive polymer products, including both organic- and silicon-based materials. Conductive polymer materials are increasingly being used in a wide range of interconnect applications, from cell phones and smart cards to military and automotive electronics. The conductive polymer market is expected to see significant growth over the next few years, with demand in the United States alone increasing 5.9 percent annually to become a $4.5 billion market in 2008, according to market researcher The Freedonia Group.

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