Orbotech to optimise Nippon Mektron's FPCB manufacturing

These systems aims to improve current and future smartphone manufacturing by facilitating the creation of flex inspections and high-throughput production capability. “Flex” PCB manufacturing, which is required to accommodate the rapidly expanding mobile phone market, will be supported by Orbotech’s Nuvogo DI systems, with DI for patterning and solder mask applications, as well as Orbotech’s AOI systems for inspection. Nippon Mektron has worked closely with Orbotech to ensure consistent product performance and quick production ramp up throughout their factories in Japan, Thailand, China and Taiwan. “From mobile phones and tablets to wearables and sophisticated automotive electronics, today’s electronics manufacturers are constantly being challenged to simplify designs, provide flexible packaging solutions and support ever-smaller devices,” said Yair Alcobi, President, Orbotech Asia East. “Through this very close collaboration, we are pleased to support Nippon Mektron’s current and future product performance requirements for flex PCB manufacturing processes and enable them to offer innovative and market-ready solutions.”