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SMT & Inspection | December 17, 2004

New Loctite Surface Mount Adhesive

The electronics group of Henkel has announced the availability of Loctite 3629, a low temperature cure epoxy adhesive.
The new material is particularly well suited for high speed dispensing on a range of industry standard machines including ProFlow cassettes for printing.

Designed to meet the needs of electronics companies, Loctite 3629 has been successfully tested in lead free production environments. Its ideal for applications where heat sensitive materials, such as Light Emitting Diodes (LED) and FR2 boards, need to be bonded prior to wave soldering. Lower curing oven temperatures required for Loctite 3629 also offer cost savings through reduced energy use.

Loctite 3629 also meets the standards of on-board reliability testing such as SIR testing. It is suitable for use on PCBs in high reliability equipment used in harsh operating environments.

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