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RoHS | November 30, 2005

Henkel develops synergistic<br> lead-free solution

Henkel has confirmed the successful qualification of a 'Green' mold compound and die attach material set, optimised for lead-free manufacturing.
The electronics group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise. The material set integrates the Hysol(r) GR828H mold compound with the Hysol QM1519 die attach adhesive,
combining the excellent molding characteristics, high productivity and low wire sweep properties of Hysol GR828H with the proven adhesive strength of Hysol QM1519. The set, designed for both 16-Lead and 14-Lead SOIC packages, has been optimised through extensive testing to comprehensively meet the demands of lead-free manufacturing.

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