DigiKey to invest $100 million in distribution expansion amid 50% growth
DigiKey is putting USD 100 million over the next 18 months into expanding its distribution centre in Thief River Falls, Minnesota, and its order management system. The component distributor expects to grow by more than 50% this year.
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COGD: Obsolescence risks have never been greater
Obsolescence risks in electronics supply chains have never been as numerous as they are today, according to Axel Wagner, Chairman of the German industry association COGD. He points to shifting semiconductor strategies, geopolitics and trade restrictions, and calls on companies to manage obsolescence across the whole company rather than within purchasing alone.
Global chip sales top $1 trillion in first eight months of 2026
Global semiconductor sales have passed USD 1 trillion for the year to date, the first time the industry has reached that level, according to the Semiconductor Industry Association (SIA). August sales amounted to USD 159.7 billion, up 144.3% from a year earlier.
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Open Innovation Meets the Factory: Industrialization Support’s Missing Link in Electronics
Component shortages, AI-driven demand and a shifting industrial base are testing Europe’s electronics supply chain.
AI demand squeezes consumer MLCCs – opening doors for Chinese suppliers
Japanese and Korean MLCC makers are cutting supply to the consumer market to prioritise capacity for AI applications. The shift is opening doors for Chinese suppliers, several of which are now undergoing qualification with global brands such as Dell, HP, ASUS and Acer, according to market research firm TrendForce.
GigaDevice boosts market reach in EMEA and Southeast Asia with Rutronik
Chinese semiconductor manufacturer GigaDevice has signed a strategic franchise partnership with German distributor Rutronik Elektronische Bauelemente, covering EMEA and Southeast Asia, including India. The agreement gives customers broader access to GigaDevice's microcontroller, sensor and power management portfolio.
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EU proposes Chips Act 2.0 and Cloud and AI Act
The European Commission has presented the European Technological Sovereignty Package, a set of legislative and strategic measures aimed at reducing Europe's dependence on foreign suppliers in semiconductors, AI, cloud computing and open source technology.
Murata starts construction of two new production buildings in Japan
Japanese component manufacturer Murata has broken ground on two new production buildings in Japan within the space of two weeks, adding to a capacity expansion programme that saw a third building completed in April. The new facilities will produce thermistors, chip inductors and noise suppression filters.
Huawei proposes Tau Scaling Law as successor to Moore's Law
At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.
Micron starts 1α DRAM production at Virginia fab in $2 billion expansion
US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.
Okmetic Vantaa fab expansion enters volume production
Okmetic has entered volume production at its expanded Vantaa facility in Finland, targeting 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers.
Mastering Heat, Securing Performance Würth Elektronik eisos
Mastering Heat, Securing Performance
Various cooling concepts are available to efficiently dissipate heat from electronic components. However, if power losses are not removed reliably, performance degradation, premature aging, or even component failure may result. Selecting the appropriate heat sink and thermal interface material is therefore essential.
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