Powering the world – How microchips are made
The semiconductor industry is back in the mainstream spotlight. Unfortunately, that usually happens during times of volatility, shortage, and turmoil.
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EU member states push for stronger Chips Act 2.0
All 27 EU Member States have called for a reinforced “Chips Act 2.0” to secure Europe’s position in the global semiconductor industry, issuing a joint declaration urging stronger action to reduce vulnerabilities and strengthen technological leadership.
Extending component lifecycles crucial for greener electronics
The world produced a record 62 million tonnes of electronic waste in 2022, according to the UN’s latest Global E-waste Monitor. Less than a quarter of that was properly collected and recycled. With volumes projected to rise to 82 million tonnes by 2030, the gap between e-waste generation and recycling is widening.
Sponsored content by FlexLink
FlexLink for PCB Management: Simple Solutions for Complex Requirements
In the world of electronics, where precision is essential and complexity is constant, FlexLink introduces a new approach: modular, autonomous, and intelligent systems that transform motion into efficiency.
Siemens and Intel expand collaboration on IC and packaging solutions
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
Magnachip to drop display business, goes all-in on power
Magnachip Semiconductor plans to transition into a pure-play power semiconductor company, a move aimed at boosting revenue growth, improving profitability, and increasing shareholder value. The company is now exploring strategic options for its display business, which could include a sale, merger, joint venture, licensing agreement, or even a complete wind-down.
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Memphis Electronic adds Ramxeed to its linecard
Specialist memory distributor Memphis Electronic has entered into a strategic collaboration with Ramxeed, formerly Fujitsu Semiconductor Memory Solution.
DigiKey enters global distribution agreement with Qorvo
DigiKey and Qorvo, a provider of connectivity and power solutions, have entered into a worldwide distribution agreement.
U-M awarded up to $7.5M to develop heat-tolerant chips
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Innoscience launches lawsuits against Infineon
Innoscience filed lawsuits against Infineon Technologies in China and two affiliates in the Suzhou Intermediate People's Court of Jiangsu Province, alleging patent infringement.
Canon delivers NIL system to Texas Institute for Electronics
Canon says that it has shipped its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium.
Sponsored content by Brady Corporation
Easily track every PCB
Complete traceability solution from BRADY can connect every circuit board in production to your Smart Factory set up. A fully automated printed circuit board labelling solution can enable traceability and manufacturing data analysis without human interference.
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Amphenol Socapex
PowerSafe: High-Power Connectors for Harsh Environments Amphenol Socapex’s PowerSafe series stems from the MIL-DTL-38999 Series III architecture and is purpose-built for high-power supply applications up to 500 V in demanding conditions. These connectors integrate highest levels of user safety, shielding effectiveness and environmental performance to meet the European standard for power equipment, DIN EN 61984 (formerly VDE 0627).
Sponsored content by Koh Young
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.
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