Warsaw | October 23, 2025

Poland's Biggest Electronics Industry Expo

Est. 2014

The conference program run parallel with the Expo. Feel free to visit any of the sessions when you register for Evertiq Expo. If you wish to participate, please contact Lunch will be served 11:00-13:00.
  • 09:00 - 10:00
    Inside the Industry: Unpacking the future of the Polish industry
    Ewelina Bednarz - Content Manager - Evertiq

    The present builds both the past and the future. Events that have occurred merge with those that could happen, impacting regions, countries, economies and industries. The development of the electronics industry has been, and continues to be, regularly affected by both political and economic movements. But what does it look like from the inside?

    Ewelina Bednarz, Content Manager at Evertiq, will host a one-to-one discussion with an industry expert to delve into various aspects of the Polish industry.

  • 10:05 - 10:55
    Component Reclaim – a green solution for the electronic industry
    Stefan Theil - CEO - Factronix

    In electronics the circular economy embodies strategies to extend product lifecycles & promote reuse. Factronix is a company that has extensive experience in this field, so during the speech it will talk about what related services are important and why.

    The lecture will therefore focus on issues such as Component Recovery, Laser Reballing, Retinning, Test Services, that is, services which involve giving a second life to electronic components that would otherwise be discarded, turning potential waste into valuable resources.

  • 11:00 - 11:30
    Obsolescence Management Starts at Design
    Ronny Nietzsche - Rochester Electronics

    Data shows that approximately half a million EOL (End of Life) notices are issued each year. This means that all electronic designs are exposed to the risk of component obsolescence.

    Unfortunately, there is a lack of robust standards and design guidelines that adequately address this challenge. While various design methodologies exist—such as Design for Excellence, Compliance, Sourcing, Manufacturing, or Test—they often treat obsolescence either superficially or not at all.

    This presentation will introduce a number of strategies that can be applied already at the design stage to better prepare for future EOL events. In short, it will offer a brief introduction to what “Design for Obsolescence” can look like in practice.

     



     

  • 11:35 - 12:20
    EMC interference vs. signal integrity
    Dominik Kowalczyk - Dacpol
  • 12:25 - 12:55
    Cleanliness means reliability – Why and how to clean PCBs in industrial electronics manufacturing
    Tomasz Pelc - PB Technik
    Piotr Nowakowski - PB Technik
  • 13:00 - 14:00
    EMS-Industry, thoughts about the future
    Mareike Haass - in4ma
    Christoph Solka - Director of Industry Intelligence for Europe - Global Electronics Association

    The European EMS industry is in turmoil. 2024 saw a substantial decline in revenues, with zero growth projected for 2025. What is happening, and how can these developments be explained? Even more important, what should we expect in 2026?

    The Global Electronics Association, in cooperation with in4ma, continuously analyzes the European EMS market and will present the most recent primary research data for the industry. Knowing the reasons for past developments are the best indicators of how this industry will develop in future. No, it won’t be “server wars” over AI, robotics, or electric vehicles. While large EMS companies are focusing on these topics in Asia, European EMS providers remain centered on different segments and another regional focus. 

    Join us for an in-depth look at 2025 and an informed perspective on what the future may bring.

  • 14:05 - 14:35
    Thermal interface materials for SiC-based power applications
    Marcin Mierzejewski - Division Thermal Management – Sales Manager Europe - KERAFOL Keramische Folien GmbH & Co. KG / Dacpol

    Electronic manufacturers use modern SiC or GaN semiconductors more often. Thanks to their high power density they perfectly match new advanced products. It becomes challenging to cool down such components, especially top-side cooled ones, where next to effective thermal management dielectric character is important. The point of the lecture is to present thermal interface materials dedicated to such applications.

  • 14:40 - 15:10
    TBA – Booked
  • 15:15 - 15:45
    AI at the Edge: Redefining Performance, Efficiency, and Trust with DEEPX
    Amir Sherman - Business Development Director - DEEPX

    DEEPX is redefining artificial intelligence by delivering groundbreaking semiconductor solutions for edge devices and smart industries, empowering real-time, energy-efficient, and scalable AI across manufacturing, smart cities, and robotics. Its current DX-M1 chip, built on 5nm technology, achieves up to 25 TOPS with ultra-low power (3–5W), supporting video analytics and multi-channel object recognition with GPU-grade accuracy using IQ8™ quantization and broad framework compatibility. Looking ahead, the forthcoming DX-M2, leveraging Samsung’s 2nm process, will deliver 80 TOPS (INT8) and support transformer models up to 20 billion parameters, enabling advanced generative AI and real-time natural language processing in power-constrained devices, with samples expected by August 2026 and efficiency matching data center innovation at under 5W

Contact

Expo Support
Support Expo
Project Manager
Daniel Myrtenblad
+46(0)73 388 8440
Sales
Daniel Myrtenblad
+46(0)73 388 8440