Warsaw | October 23, 2025
Poland's Biggest Electronics Industry Expo
Est. 2014
The conference program run parallel with the Expo. Feel free to visit any of the sessions when you register for Evertiq Expo. If you wish to participate, please contact info@evertiq.com
Lunch will be served 11:00-13:00.
- 09:00 - 10:00Panel Discussion
- 10:05 - 10:55TBA
- 11:00 - 11:30Obsolescence Management Starts at DesignRonny Nietzsche - Rochester Electronics
- 11:35 - 12:20EMC interference vs. signal integrityDominik Kowalczyk - Dacpol
- 12:25 - 12:55Cleanliness means reliability – Why and how to clean PCBs in industrial electronics manufacturingTomasz Pelc - PB TechnikPiotr Nowakowski - PB Technik
- 13:00 - 14:00Keynote Speech
- 14:05 - 14:35Thermal interface materials for SiC-based power applicationsMarcin Mierzejewski - Division Thermal Management – Sales Manager Europe - KERAFOL Keramische Folien GmbH & Co. KG / Dacpol
Electronic manufacturers use modern SiC or GaN semiconductors more often. Thanks to their high power density they perfectly match new advanced products. It becomes challenging to cool down such components, especially top-side cooled ones, where next to effective thermal management dielectric character is important. The point of the lecture is to present thermal interface materials dedicated to such applications.
- 14:40 - 15:10TBA
- 15:15 - 15:45TBA