Warsaw | October 23, 2025
Poland's Biggest Electronics Industry Expo
Est. 2014
- 09:00 - 10:00Inside the Industry: Unpacking the future of the Polish industryEwelina Bednarz - Content Manager - Evertiq
The present builds both the past and the future. Events that have occurred merge with those that could happen, impacting regions, countries, economies and industries. The development of the electronics industry has been, and continues to be, regularly affected by both political and economic movements. But what does it look like from the inside?
Ewelina Bednarz, Content Manager at Evertiq, will host a one-to-one discussion with an industry expert to delve into various aspects of the Polish industry.
- 10:05 - 10:55Component Reclaim – a green solution for the electronic industryStefan Theil - CEO - Factronix
In electronics the circular economy embodies strategies to extend product lifecycles & promote reuse. Factronix is a company that has extensive experience in this field, so during the speech it will talk about what related services are important and why.
The lecture will therefore focus on issues such as Component Recovery, Laser Reballing, Retinning, Test Services, that is, services which involve giving a second life to electronic components that would otherwise be discarded, turning potential waste into valuable resources. - 11:00 - 11:30Obsolescence Management Starts at DesignRonny Nietzsche - Rochester Electronics
Data shows that approximately half a million EOL (End of Life) notices are issued each year. This means that all electronic designs are exposed to the risk of component obsolescence.
Unfortunately, there is a lack of robust standards and design guidelines that adequately address this challenge. While various design methodologies exist—such as Design for Excellence, Compliance, Sourcing, Manufacturing, or Test—they often treat obsolescence either superficially or not at all.
This presentation will introduce a number of strategies that can be applied already at the design stage to better prepare for future EOL events. In short, it will offer a brief introduction to what “Design for Obsolescence” can look like in practice.
- 11:35 - 12:20EMC interference vs. signal integrityDominik Kowalczyk - Dacpol
- 12:25 - 12:55Cleanliness means reliability – Why and how to clean PCBs in industrial electronics manufacturingTomasz Pelc - PB TechnikPiotr Nowakowski - PB Technik
- 13:00 - 14:00EMS-Industry, thoughts about the futureMareike Haass - in4maChristoph Solka - Director of Industry Intelligence for Europe - Global Electronics Association
The European EMS industry is in turmoil. 2024 saw a substantial decline in revenues, with zero growth projected for 2025. What is happening, and how can these developments be explained? Even more important, what should we expect in 2026?
The Global Electronics Association, in cooperation with in4ma, continuously analyzes the European EMS market and will present the most recent primary research data for the industry. Knowing the reasons for past developments are the best indicators of how this industry will develop in future. No, it won’t be “server wars” over AI, robotics, or electric vehicles. While large EMS companies are focusing on these topics in Asia, European EMS providers remain centered on different segments and another regional focus.
Join us for an in-depth look at 2025 and an informed perspective on what the future may bring.
- 14:05 - 14:35Thermal interface materials for SiC-based power applicationsMarcin Mierzejewski - Division Thermal Management – Sales Manager Europe - KERAFOL Keramische Folien GmbH & Co. KG / Dacpol
Electronic manufacturers use modern SiC or GaN semiconductors more often. Thanks to their high power density they perfectly match new advanced products. It becomes challenging to cool down such components, especially top-side cooled ones, where next to effective thermal management dielectric character is important. The point of the lecture is to present thermal interface materials dedicated to such applications.
- 14:40 - 15:10TBA – Booked
- 15:15 - 15:45AI at the Edge: Redefining Performance, Efficiency, and Trust with DEEPXAmir Sherman - Business Development Director - DEEPX
DEEPX is redefining artificial intelligence by delivering groundbreaking semiconductor solutions for edge devices and smart industries, empowering real-time, energy-efficient, and scalable AI across manufacturing, smart cities, and robotics. Its current DX-M1 chip, built on 5nm technology, achieves up to 25 TOPS with ultra-low power (3–5W), supporting video analytics and multi-channel object recognition with GPU-grade accuracy using IQ8™ quantization and broad framework compatibility. Looking ahead, the forthcoming DX-M2, leveraging Samsung’s 2nm process, will deliver 80 TOPS (INT8) and support transformer models up to 20 billion parameters, enabling advanced generative AI and real-time natural language processing in power-constrained devices, with samples expected by August 2026 and efficiency matching data center innovation at under 5W