Presentation of the mechanical/electrical/software solutions developed to build robotic workstations that can be quickly changed or reconfigured according to the production load.

Measuring equipment is used in R&D departments at every construction stage. Starting from concept creation, prototyping, initial launch, to compatibility tests and final quality control. Meet Tadeusz (Tad) Asyngier, who will present practical advice on the use of Tektronix measuring equipment.

Due to a continuously improving price-performance ratio and numerous technological advantages, laser systems are being used for more and more applications, particularly in depaneling. Gentle processing and the technically clean separation process can significantly reduce both stress and residues and therefore reject rates. Increasing application requirements in terms of quality, accuracy and reliability can be met without restrictions now and in the future.

Electronic Component lifecycles between launch and Obsolescence are shortening. Improvement in die manufacturing technology and increase in electronic components usage in new technologies and markets causing shortening of life cycles. AI(Artificial Intelligence), consumer electronics, limited fabrication capacity and changes in packages are driving faster change. Obsolescence is therefore affecting more companies, more frequently than ever before. In this presentation Jaroslaw will speak about the impact of obsolescence in Semiconductors and how it can be managed. 

Electronic components such as PCBs are covered with various coatings to provide them with protection from the environment. What if a given component generates high temperature and the material used is a thermal insulator? The presentation aims to discuss this issue and show ways to protect while taking into account the issue of heat dissipation using specialist granulates.

Perfection is achieved, not when there is nothing more to add, but when there is nothing left
to take away.” The words of Antoine de Saint Exupery convey important wisdom, the
timelessness of which has been repeatedly discovered by members of the AGH Space
Systems Rocket Team. In this lecture, engineers responsible for developing electronics for
the sounding rocket project will present how extreme conditions, time pressure and adversity
shaped their design process. Free from overhead and results-oriented, extreme design is the
answer to extreme challenges. Find out how the assumptions of this methodology can
increase the productivity and satisfaction of your team!

During the lecture, we will present available solutions in the field of automated optical inspection (AOI) for THT through-hole assembly both before and after the soldering itself. We will discuss the available 2D and 3D technologies and talk about simultaneous inspection of the top and bottom sides of printed circuit boards.