Warsaw | October 24, 2024

The conference program run parallel with the Expo. Free to visit any of the sessions when you register for Evertiq Expo. Lunch will be served 11:00-13:00.
  • 09:00 - 09:30
    Configurable production modules for variable and short production.
    Rafał Maślanka - Project Manager - FITECH

    Presentation of the mechanical/electrical/software solutions developed to build robotic workstations that can be quickly changed or reconfigured according to the production load.

  • 09:35 - 10:05
    Practical tips on the use of measuring equipment in the design of electronic devices
    Tadeusz Asyngier - Tektronix Senior Application Engineer - Tespol Sp. z o.o.

    Measuring equipment is used in R&D departments at every construction stage. Starting from concept creation, prototyping, initial launch, to compatibility tests and final quality control. Meet Tadeusz (Tad) Asyngier, who will present practical advice on the use of Tektronix measuring equipment.

  • 10:10 - 10:40
    More yield, performance and quality through innovative laser technology
    Marek Zduńczuk - Managing Director - LPKF / SE Spezial Electronic Sp. z o.o.

    Due to a continuously improving price-performance ratio and numerous technological advantages, laser systems are being used for more and more applications, particularly in depaneling. Gentle processing and the technically clean separation process can significantly reduce both stress and residues and therefore reject rates. Increasing application requirements in terms of quality, accuracy and reliability can be met without restrictions now and in the future.

  • 10:45 - 11:15
    Semiconductor Obsolescence Management – ​​EOL risk management
    Jarosław Klofczyński - Regional Sales Manager NEE - Rochester Electronics

    Electronic Component lifecycles between launch and Obsolescence are shortening. Improvement in die manufacturing technology and increase in electronic components usage in new technologies and markets causing shortening of life cycles. AI(Artificial Intelligence), consumer electronics, limited fabrication capacity and changes in packages are driving faster change. Obsolescence is therefore affecting more companies, more frequently than ever before. In this presentation Jaroslaw will speak about the impact of obsolescence in Semiconductors and how it can be managed. 

  • 11:20 - 11:50
    An innovative approach to the protection of electronic components using thermally conductive granules
    Marcin Mierzejewski - Thermal specialist - DACPOL Sp. z o.o. / KERAFOL - Keramische Folien GmbH & Co

    Electronic components such as PCBs are covered with various coatings to provide them with protection from the environment. What if a given component generates high temperature and the material used is a thermal insulator? The presentation aims to discuss this issue and show ways to protect while taking into account the issue of heat dissipation using specialist granulates.

  • 11:55 - 12:25
    Space challenges require extreme solutions - extreme design and development of rocket electronics
    Piotr Sławęcki - AGH Space Systems Rocket Electronics Team Leader - AGH Space Systems Rocket Section & Stratospheric Balloon - AGH University of Science and Technology
    Wojciech Żebrowski - AGH Space Systems Rocket Electronics Team Member

    Perfection is achieved, not when there is nothing more to add, but when there is nothing left
    to take away.” The words of Antoine de Saint Exupery convey important wisdom, the
    timelessness of which has been repeatedly discovered by members of the AGH Space
    Systems Rocket Team. In this lecture, engineers responsible for developing electronics for
    the sounding rocket project will present how extreme conditions, time pressure and adversity
    shaped their design process. Free from overhead and results-oriented, extreme design is the
    answer to extreme challenges. Find out how the assumptions of this methodology can
    increase the productivity and satisfaction of your team!

     

     

  • 12:35 - 13:05
    Checking the correctness of THT through-hole assembly using automated optical inspection (AOI)
    Karol Sowa - Company Owner / Process Specialist - Sowa Electronics, in cooperation with MEK Marantz Electronics

    During the lecture, we will present available solutions in the field of automated optical inspection (AOI) for THT through-hole assembly both before and after the soldering itself. We will discuss the available 2D and 3D technologies and talk about simultaneous inspection of the top and bottom sides of printed circuit boards.

  • 13:10 - 14:10
    The East-West difference of EMS companies in Europe
    Dieter G. Weiss - Founder, in4ma and Data4PCB Market Research - in4ma
    Dr. Mareike Haass - in4ma Market Research - in4ma

    There are more than 1760 EMS companies in Western Europe but only about 400 EMS companies in Central Eastern Europe. We explain the structure of this industry and its advantages and disadvantages. We look at past developments as well as discussing future developments of EMS. We explain the product shifts and the reasons behind these developments.

    The presentation will be held in English.

     

     

     

     

     

  • 14:15 - 14:45
    From Lightspeed Molecular Diagnostics to Thin Coating Discoveries
    Karol Maryniowski - Investor Relations Manager - SDS Optic
    Marcin Zybert, Ph.D. - Head of Optoelectronics Department - SDS Optic

    SDS Optic S.A. creates and develops innovative medical devices for real-time molecular diagnostics, merging photonic and optoelectronic technologies in medicine for various indications, with a prime focus on HER2+ breast cancer biomarker detection. The development of this novel diagnostic methodology has opened the gate to new discoveries in coating technology, not only in the optoelectronic space.

  • 14:50 - 16:00
    Discussion Panel