Laser depaneling is becoming more widely used since the demand for excellent cutting quality and increasing cost pressure require one to reevaluate the use of traditional production methods. For example, laser depaneling provides the highest technical cleanliness that improves the durability of electronics, increase yield and reduces manufacturing costs. Furthermore, laser technology provides a new path to increase panel efficiency and therefore reduce material waste and costs.

Even despite their high commercial potential, many potentially disruptive technologies are not commercialized due to various obstacles such as low economic levels, insufficient technological maturity, or a lack of dialogue between industry and academia. Therefore, the commercialization of R+D research is a difficult task that requires careful planning for its efficient implementation. In this approach, this contribution sums up the opportunities for industry, in particular small and medium-sized enterprises, to carry out research and development works to commercialize semiconductor technologies devoted to integrated circuits, gallium nitride and silicon carbide-based systems or quantum cascade lasers.

The lecture aims to present the basic properties of thermally conductive materials and to discuss the features that these properties affect, based on Kerafol products. Knowledge of the described parameters will help determine the criteria for selecting the appropriate solution.

Show our customers what the hidden costs of labeling are, how they arise and how they can be minimized.

Furthermore, we will explain why it makes sense to talk to a full service provider instead of 3 – 5 parties just to save a little bit of money.

In the industry we see tendency moving from acrylic materials towards to higher viscosity protective coatings. For this reason is interesting to review the differences in quality expectation in terms of accuracy and the general quality acceptance criteria.

Electronic Component lifecycles between launch and Obsolescence are shortening. Improvement in die manufacturing technology and increase in electronic components usage in new technologies and markets causing shortening of life cycles. AI(Artificial Intelligence), consumer electronics, limited fabrication capacity and changes in packages are driving faster change. Obsolescence is therefore affecting more companies, more frequently than ever before. In his presentation Paul will speak about the impact of obsolescence in Memory devices and how it can be managed.

Usually bad quality of solder connections are detected when the product leaves the reflow oven or when a broken product is returned back from a customer. It is worth considering and analysing where is the real source of these problems. Reducing these will improve the production and repair cost finally leading to satisfied your customers.