PROGRAM The conference program runs parallel with the Expo. Free to visit any of the sessions when you register for Evertiq Expo.
  • 09:00 - 09:30
    After the Big Shortage – How Global Distribution Shifts Towards Digital Supply Chain Management
    Georg Steinberger - Semiconductor Industry and Market Expert - Sourceability

    The electronics components industry as one of the most dynamic industries on the planet regularly falls victim to its cyclicality – major swings from oversupply to severe allocations. The last 2 years have seen an outrageous mix of transportation problems, demand surge and severe shortages across many component families that even in the current downturn still exist. 
    While cyclicality will stay with us forever, the question arises “how to mitigate the problems of supply and demand mismatches by digital means?” The future supply chain will get more complicated and will need more digital tools to create a quasi-global transparency on both product information, availability alerts and transactional processes.
    This presentation tries to show some ways of improving supply chain transparency by a cooperative approach across company boundaries.
    Georg Steinberger is a 35-year industry and distribution veteran and current works as a freelance industry consultant, writer and speaker for Sourceability. He is also Chairman of the German Components Distribution Association (FBDi) and President of the International Electronics Distribution Association (IDEA).

  • 09:35 - 10:05
    How to increase PCB depaneling efficiency with Laser Technology
    Javier Gonzalez - Sales Manager - InnoLas Solutions GmbH
    Laser depaneling is becoming more widely used since the demand for excellent cutting quality and increasing cost pressure require one to reevaluate the use of traditional production methods. For example, laser depaneling provides the highest technical cleanliness that improves the durability of electronics, increase yield and reduces manufacturing costs. Furthermore, laser technology provides a new path to increase panel efficiency and therefore reduce material waste and costs.
  • 10:10 - 10:40
    Prototyping in electronics production, including DFM method.
    Kim Engmark - Country Manager: Denmark - Nord Electronics Solutions Sp. z o.o. Nordes
    Prototyping in electronics manufacturing is the process of creating an initial version of an electronic device to test the functionality and performance of the design before mass production. The Design for Manufacturability (DFM) method is an approach that takes into account the capabilities and limitations of manufacturing processes when designing a product. DFM refers to the design of products that are designed to be durable in electronic manufacturing. With DFM-enabled prototyping in electronics manufacturing, prototypes are created with mass production requirements in mind. Prototypes can then be tested for performance and quality, while manufacturing issues can be identified and resolved at the prototyping stage. In this way, the product can be readily mass-produced, thus minimizing costs and risks associated with production quality issues when ready for mass production.
  • 10:45 - 11:15
    Value of 5G and edge computing to power smart industries
    Jay Siriwardena - Senior Sales Manager UK and Northern Europe - Thundercomm Technology Co., Ltd. (co-owned by Qualcomm)
    As the industries evolve beyond Industry 4.0, the need for reliable connections between the smart devices and ability to perform complex decision-making tasks closer to the edge are becoming mandatory. Thundercomm will talk about how 5G and Edge AI computing can be an enabler on this journey towards the next level of smart industries.
  • 11:20 - 11:50
    Activities at Swedish strategic innovation program - Smarter Electronic Systems
    Anna Wibom - Program Manager - Smartare Elektroniksystem (Strategiskt Innovationsprogram)
    Activities at Smarter Electronic systems and examples from project portfolio and Swedish filed (field) of electronic excellence. Examples of project funding opportunities for electronic systems of the future that are characterized by a high degree of integration and the use of innovative manufacturing methods and construction methods such as 3D interconnect, System-on-Chip, Network-on-Chip and printed electronics.
  • 11:55 - 12:25
    Protect your brand and assure profitability through regulatory compliance
    Fredrik Hirn - Senior Sales Manager & Country ICT Leader - Intertek Sweden
    Understand the value of proactive regulatory compliance.
  • 12:35 - 13:05
    Edge AI processors, hardware and software
    Patrik Björklund - Director of sales - Tritech Solutions
    The demand for accelerating AI workloads at the edge is increasing as more applications demand both low latency and computing power. A wide range of options from GPUs and FPGAs to dedicated ASICs and application processors with integrated NPUs have become available from an ever-growing number of vendors. As the software ecosystem has evolved to opensource frameworks and even pretrained models and vertically oriented application suites from leading silicon vendors, as well as ready-to-run hardware modules and systems, accelerating product development by using off-the-shelf hardware and software components is the dominating trend in this new domain. In this presentation we will cover the most important and popular technology options available for embedded systems designers.
  • 13:10 - 13:40
    How to react to exploding market prices: Cost efficiency strategies in the PCB design stage
    Sebastian Seifert - Head of Area Sales Management - KSG GmbH
    Cost increases have dominated the headlines over the last years. In times of rapidly rising prices for materials, components, supply of energy, metals or chemicals – each opportunity to reduce overall product costs is of huge importance for your company’s success. The field of printed circuit board design offers a broad range of cost improvement potential: material selection, stack-up optimisation, drilling concepts or the definition of tolerances. Let us explore the most effective measures which will help you to significantly reduce product costs of your PCBs without risking quality impacts. Cost and process efficiency have never been as important as they are today.
  • 13:45 - 14:15
    Component Obsolescence – How to minimise the costs and risks
    Ken Greenwood - Technical Sales Manager - Rochester Electronics

    Electronic Component life-cycles -between launch and Obsolescence are shortening. A large percentage of the worlds electronic component demand is driven by consumer electronics and this market typically has shorter and shorter product lives. Obsolescence is therefore affecting more companies, more regularly than ever before. In his presentation, Graham will speak about the impact of obsolescence and how it can be managed.

  • 14:20 - 14:50
    Displays & HMI market trends
    Daniel Aspeskär - Business Development Manager - Martinsson Elektronik AB

    As the Display, GUI and HMI is getting increasingly important in how the user experiences your product, the market evolves. In this presentation, Daniel will give an overview of the display & HMI market, trends and examples of new products and trending services.

  • 14:55 - 15:25
    How do you manage your projects with demands on higher quality and less cost without losing track on the process?
    John Ludvigsen - Technical Sales Engineer Application Lifecycle Management (ALM) - InnoFour
    Embedded software is in virtually all the products we come in contact with every day. For example, there are 100+ million lines of code in automotive, 24% of Medical device recalls are due to software issues, and there's 15.4% growth in the software driven "Smart Appliance" market. As a result the use of embedded software is quickly infringing on hardware’s dominance in the product development process. However in many environments software development is a siloed activity that leads to disconnects between product requirements and implementation that leads to product recalls or product failures. In legacy software development environments, many different point solutions are used to manage the application lifecycle. As a result, development artifacts are scattered, slowing down collaboration, hindering transparency, undermining integrity and making it difficult to drive innovation. This presentation of Polarion Application Lifecycle Management will cover the challenges in today’s embedded software development and how Polarion can help organizations with a unified solution that divers project transparency through real-time aggregated management information. Polarion enables everyone to be aligned around what is being built and why, to drive advancement while protecting integrity and compliance. Polarion helps teams respond faster and with better quality to new business opportunities and customer demands. The presentation will also show how it’s possible to work with different stakeholders like clients and managers and with those that are in the project so that everybody has a real-time view of the status of the project.
  • 15:30 - 16:00
    The U.S. CHIPS Act is already making an impact
    Dennis Dahlgren - Editor in Chief - Evertiq

    Yesterday, Evertiq reported that the U.S. CHIPS Act has already sparked USD 200 billion in private investments across the country. But where are all of these new fabs going to be built? 
    The Semiconductor Industry Association (SIA) pointed out in a report that over 40 new semiconductor ecosystem projects have been announced across the U.S. since May 2020. We’re talking new fabs, expansions of existing sites, and also facilities that supply and produce materials and equipment for the semiconductor industry. 

    Count it all up and these projects are valued at nearly USD 200 billion in private investments, announced across 16 states. All of this means that about 40,000 new high-quality jobs are being created in the semiconductor ecosystem as part of the new projects. 

    Read the full article HERE


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