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Material | November 28, 2007

Semiconductor packaging material to<br>reach $20.2 billion by 2011

The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 billion in 2007 and grow to $20.2 billion by 2011, according to a new study by SEMI and TechSearch International.
Laminate substrates remain the largest segment of the market, worth an estimated $6.2 billion globally in 2007, and on a unit basis are projected to grow at a compound annual growth rate of over 12 percent over the next five years.

The report, titled “Global Semiconductor Packaging Materials Outlook- 2007/2008 Edition,” covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.

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