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PCB | October 18, 2007

AT&S selects Photec photoresist

Enthone announce the acceptance of PHOTEC H-9825 dry film photoresist by AT&S Austria Technologie & Systemtechnik AG.
The dry film is currently in volume production at the AT&S Hinterberg, Austria, facility with implementation scheduled to be completed throughout AT&S Asia-Pacific manufacturing facilities over the next year.

Thomas Schlinger, Commodity Managerof AT&S Global Procurement, said, “After reviewing several dry film candidates, AT&S chose Enthone technical knowledge and PHOTEC high performance dry film to meet our current and future manufacturing requirements. With over ten years of collaboration between our companies, Enthone’s core competency in delivering and supporting the high yield resists manufactured by Hitachi Chemical, made the difference in our selection process.”

Additionally, AT&S is currently evaluating PHOTEC DL-1000, a new series of laser imaging dry film that is ideally suited for both 355 and 405 nm applications. The resist’s superior photosensitivity for fast exposure and increased productivity, wide operating window, and excellent adhesion and resolution characteristics have contributed to increased interest from AT&S.

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