Flex Circuits Bend to Fit More Applications

Merely a novelty just a few years ago, flexible circuits have moved into mainstream use in many applications.

Designers are deploying flex circuits for high-volume, surface-mount PCB applications, as well as for array and stacked IC packaging techniques, such as flip-chip, micro-ball grid array (BGA), tape BGA (TBGA), 3D, chip-scale packaging (CSP) and system-in-package (SiP). Click here to read the full article.