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New process investment at Merlin Circuit Technology

A new MECetchBOND process recently installed at Deeside North Wales PCB manufacturer Merlin Circuit Technology is already proving beneficial for Merlin’s customers.
The process replaces pumice brushing and maximises the bond of solder mask to both copper and resin surfaces. The new process enables smaller solder mask dam feature retention and enhanced bond strength.

The process is fully conveyorised with ability to continually process panels of different thickness without machine or process adjustments resulting in manufacturing time reductions.

This investment was supported by the Welsh Government’s Business Innovation programme.

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February 08 2018 5:15 pm V9.2.4-1