2006 Technical Conference at APEX

Our industry is rapidly changing around us. Technological, legislative and competitive challenges must be faced every day. Whether the challenge may be switching SMT lines to lead free, implementing RoHS and WEEE, incorporating new technology, or selecting new materials, the technical conference at IPC Printed Circuits Expo, APEX and the Designers Summit will cover issues affecting the electronics industry's entire supply chain. The three-day technical conference will take place February 8-10, 2006 at the Anaheim Convention Center in Anaheim, Calif. This year's all- inclusive format will welcome numerous global experts from every facet of industry's supply chain, including representatives from OEMs, EMS companies, suppliers, PCB manufacturers and the PCB design community. The Technical Conference Program Committee carefully selected 115 papers based on their ability to move industry the forward using the latest technology or new process efficiencies to improve competitiveness. The 40 technical sessions will focus on lead free technologies, RoHS/WEEE compliance, advanced technology, packaging, materials, assembly processing, embedded passives, assembly equipment, quality, reliability and testing, design and PCB fabrication. An additional 15 poster presentations and nine free forums will also highlight technical information from additional authors. Conference attendees may participate in both at no additional charge. For more information of the 2006 technical conference program, visit www.GoIPCShows.org.