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11
June
2012

Escatec adds PoP capabilities

Escatec has added Package-on-Package (PoP) capability to its production facilities at Heerbrugg in Switzerland.
Martin Muendlein, Escatec's Engineering Manager, explained, "Until now, PoP has only been used in high volume applications such as mobile phones, where it provides high density packaging, low power and high performance. We believe that we are one of the first contract manufacturers in Europe to offer this as a low volume option to customers. It is ideal for customers wanting to make portable devices that need high performance processors and where space is tight. We already have one customer wanting to use PoP for their next generation of a hand held terminal."
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