Electronics Production |
Discovering Gold as<br> a Lead-free Substitute
When looking at Lead-free alternatives Gold-stud bumping is named as a cost effective alternative to older bumping technologies, evaporation and electroplating.
The looming lead-free debacle is driving desperate alternative seekers to find proven lead-free flip chip bumping technologies. The leading candidate is gold bumping, which has a long history of high-volume production.
You can read more about this technology at Advanced Packaging
