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SMT & Inspection | June 03, 2009

Orbotech to launch three new machines

Israel based AOI specialist Orbotech is introducing several new products designed specifically for advanced packaging applications.
Orbotech’s Ultra Discovery F1 AOI-system provides inspection FC-BGA and COF designs down to 7um line and space. Orbotech is also launching Ultra VeriFine-A verification system which includes high power magnification using a microscope objective to enable verification of microscopic defects in FC-BGA IC substrate production down to 7 micron line width. Finally, Orbotech’s Ultra PerFix automated optical repair system has automatic repair of shorts on fine-line PCBs down to 10 micron lines. This is making it possible for saving of substrates that previously would have been scrapped, US based web site PCB007 reported.

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