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Qualcomm has agreed to acquire Modular Inc, an AI software infrastructure company whose platform allows developers to build and deploy AI across different hardware architectures without rewriting code for each one. The deal is expected to close in the second half of 2026.

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The expansion is part of Hitachi Energy’s USD 9 billion USD global investment program to increase capacity and add 15,000 people to scale manufacturing, R&D, and digitalization, including boosting efficiency through AI-enabled processes.

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NatPower

Projects under the agreement will be sited in Italy and the UK and will be owned and operated by NatPower. Tesla will provide Megapack, their BESS as well as EPC and bankable trading services, with long-term revenues warranties.

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The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.

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Rotterdam-based semiconductor metrology company Nearfield Instruments has closed a USD 380 million Series D funding round, valuing the company at USD 1.6 billion. The round is the largest deep-tech funding round ever completed in the Netherlands.

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NLC India Ltd (NLCIL), which has a presence in mining and power generation, has been diversifying into large-scale renewable and green energy initiatives, including solar, wind, pumped hydro storage and BESS.

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The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.

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A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.

Robert Bosch GmbH has agreed to pay a USD 36 million penalty to the US Bureau of Industry and Security after shipping MEMS sensor products and software to Huawei and its affiliates without the required export licence. The shipments took place between September 2020 and September 2024.

France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.

By combining the PSYONIC Ability Hand with an ABB GoFa cobot, the collaboration will explore how touch and motion data generated by human prosthetic use can be used to train robots to perform delicate, variable tasks that have traditionally been difficult to automate.

The joint program includes a multi-year plan focused on solid-state battery development and associated manufacturing processes. The agreement follows Honda’s successful completion of a technology evaluation agreement with QuantumScape Corporation (QS).

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Under the terms of the five-year contract, TVS SCS will support Babcock in key areas including procurement, inventory planning, stock management and distribution of spare parts.

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Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure

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The collaboration is expected to add significant wind power, solar, and energy storage capacity and help create an AI-powered energy infrastructure that integrates energy systems with intelligent systems.

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The two companies will explore opportunities to accelerate the delivery of critical capabilities and innovation by combining Lockheed Martin’s defense production expertise with General Motors’ advanced industrial capabilities in commercial manufacturing and engineering.

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As a core partner in physical AI, Viam will work with Tech Mahindra to provide their global enterprise clients with direct access to the Viam platform for managing and maintaining robotic fleets at scale.

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The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.

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The agreement creates a foundation for the companies to jointly identify high-impact industrial use cases and explore quantum and hybrid quantum-classical approaches for next-generation engineering workflows.

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Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.

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Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.

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Under the MoU, the two companies will deploy Airbus Flexrotor UAVs across international markets, leveraging Extensee’s end-to-end operational capabilities with Garuda Aerospace’s drone technology expertise.

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The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

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The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

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The 10-year agreement brings together Cellula Robotics’commercial off-the-shelf (COTS) long-endurance autonomous underwater vehicle (AUV) platforms with Metron’s adaptive mission autonomy and undersea warfare and maritime domain expertise.

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Through the strategic alliance, Hitachi will establish and globally deploy Hitachi’s Forward Deployed Engineers (FDEs) model that leverages its strengths in IT, OT, and products cultivated through Lumada, together with Google Cloud’s advanced AI.

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The three parties will work together to build an electric two-wheeler ecosystem that includes Battery Swapping Stations in central Hanoi, battery standards, safety management systems, and new platform-based business models for electric two-wheelers.

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The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.

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The companies plan to combine Hitachi’s IT expertise, operational technology and product manufacturing knowledge with Intel’s computing capabilities and silicon-based platforms to develop next-gen compute capabilities and industry solutions.

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Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

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The partners will use the platform to conduct research on the application of near-term quantum and hybrid quantum-classical computing including areas such as portfolio optimization and expanding explorations around quantum machine learning.

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Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

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