Exascale, Compal to develop platform for next-gen GPU systems
The platform combines Compal’s production-grade GPU server platforms and liquid cooling systems with Exascale’s Modular Data Center (MDC) and SST power architecture to validate power, compute, cooling and controls as an integrated system.
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LG Chem partners with Volkswagen to advance next-gen mobility materials
The two companies will collaborate on developing next-generation plastics and composite materials, as well as on reducing vehicle weight and improving performance, using LG Chem’s ABS (high-value-added synthetic resin) and EP (engineering plastics).
Memphis signs distribution deal with Puya Semiconductor
Founded in Shanghai in 2016, Puya Semiconductor supplies NOR Flash and EEPROM memories spanning a wide range of densities, voltage options, temperature grades, and package configurations for industrial, consumer, wearable, PC, mobile, automotive and IoT applications
Sponsored content by Aurightec
What an EMS Laboratory Actually Finds When Electronics Fail
Most field failures that reach our laboratory are not exotic. They are the same handful of mechanisms, year after year. What varies is where they were introduced — and in the majority of cases we investigate, the durable fix turns out to be a design change rather than a process adjustment.
Infineon opens backend site in Bangkok with room for five modules
Infineon Technologies has inaugurated a new backend manufacturing site in Samut Prakan, Bangkok. The site currently has one module but is designed to grow to five, which could make it one of Infineon's largest backend sites over time.
Tata Electronics, Sojitz, NRS to develop semiconductor materials supply chain
Under this partnership, Sojitz Corporation and NRS CORPORATION will explore and validate a supply chain management framework in support of the development of a robust semiconductor materials ecosystem for Tata Electronics’ Fab in Dholera, Gujarat.
AMD to acquire World Labs in $8.2 billion all-stock deal
AMD has signed a definitive agreement to acquire World Labs, the AI model and research lab led by Fei-Fei Li. The all-stock transaction is valued at approximately USD 8.2 billion and adds a team of researchers and model experts to AMD, strengthening its ability to develop AI hardware, software and systems around the needs of emerging models and applications.
LG Innotek targets $647 million profit from substrates by 2031
LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.
NX Group, ISM to advance chip logistics infrastructure in India
Under the MOU, Japan’s Nippon Express (NX) Holdings and India Semiconductor Mission (ISM) will work closely to address logistics-related challenges and help in developing infrastructure to strengthen India’s semiconductor ecosystem.
Tata Electronics partners with Besi to strengthen packaging capabilities
Leveraging Besi’s portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Assam and advance its journey toward next-gen packaging capabilities.
Havoc, CSBC to field autonomous surface vessels in Taiwan
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.
Sponsored content by TME Transfer Multisort Elektronik
Raytac Bluetooth Low Energy modules in TME's offer
Contemporary communication has been dominated by wireless systems. Electronics increasingly rely on data exchange without the use of cables. This applies to household appliances, as well as industrial, medical automation, and Internet of Things solutions. One of the most commonly used short-range communication standards is Bluetooth, particularly its energy-efficient variant, Bluetooth Low Energy (BLE), which allows for the construction of compact battery-powered devices.
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