OctOpportunities for Process Optimizations with New Silicone Adhesives
19Hosted By Dow Corning Corporation
Thursday, 19 October 2017 at 15:00
DetailsWhen assembling electronics modules, manufacturers can optimize processes to reduce costs. The choice of adhesive can greatly impact those costs, through the energy use, process time and other factors. Learn about the less-obvious ways that your choice of adhesives can make your process more efficient.
This webinar looks at the newest silicone adhesive technologies and how they are providing more options to optimize your assembly processes. These innovations include Quick in Connect (QiC) adhesives, high “green strength” adhesives, Thermal Radical CureTM adhesives, and the new fast low-temperature cure adhesive (Dow Corning® EA-6060 Adhesive).
The webinar will compare the new silicone adhesives with more-traditional options, discussing cure times, energy needed for curing (if any), adhesion profiles (robustness), pricing, “green strength,” and applications.