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Fusion Worldwide Unveils Updated Brand and New Website
: For over two decades, Fusion Worldwide has been more than just an open market distributor—we've been a beacon of guidance for our customers in the ever-evolving landscape of electronic component distribution. In today's highly competitive open market sourcing landscape, electronics manufacturers must be ahead in every aspect of their business. This means being out in front of potential supply disruption, out in front of new business opportunities, and out in front of bottom-line savings.
Guerrilla RF acquires GaN device portfolio from Gallium Semiconductor
Guerrilla RF has finalised the acquisition of Gallium Semiconductor's entire portfolio of GaN power amplifiers and front-end modules.
China beefs up its chip production – grew 40% in 1Q24
Backed by official support and continued industry investments, China's total chip production reportedly surged by 40% during the first quarter of 2024 – reaching 98.1 billion units.
SK Hynix to invest $3.86B in DRAM production in South Korea
SK hynix says that it plans to expand production capacity of the next-generation DRAM, including HBM, in response to the rapidly increasing demand for AI semiconductors.
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RFID or barcode? Make the right decision for your assets tracking!
From consumer products and food packaging to pipe fittings and hazardous material containers, just about everything has some sort of label affixed to it that contains important information that buyers, sellers or manufacturers need to be aware of. Most of us are familiar with barcodes and QR codes, but the technology that goes into them may come as a surprise. Read the full blog & watch the short video!
UCT opens new manufacturing facility in Malaysia
Ultra Clean Holdings, Inc. (UCT), has officially inaugurated its new manufacturing facility in Pulau Pinang. The new facility represents an investment of MYR 250 million (about EUR 49 million).
Silicon Creations hits milestone of 10 million wafers in production with TSMC
Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.
Renesas share impact of the April 17 earthquake
A magnitude 6.6 earthquake, measuring a weak 6 on Japan’s seismic intensity scale, struck off the west coast of Shikoku island on April 17.
Toshiba to axe 5,000 jobs as re-structure continues
Japan's Toshiba Corp is reported to have cut its staff count by 5000 – that's 10% of the total – as it tries to streamline its operations as a private company.
Unnamed firm buys world's second High-NA EUV machine
ASML has disclosed that it has shipped a second Extreme Ultraviolet Lithography (EUV) machine, but it hasn't named the customer.
Axcelis ships multiple systems to SiC chipmakers
Axcelis Technologies announces multiple shipments of the Purion Power Series ion implanter systems to silicon carbide (SiC) power device chipmakers worldwide.
Tampere University secures EU funding for semiconductor pilot line
On 11 April, the Public Authorities Board of the Chips Joint Undertaking selected four pilot production lines for semiconductor chips that will receive funding from the EU. The selected pilot line in Finland will be set up by Tampere University and the VTT Technical Research Centre of Finland.
Wolfspeed selects Aixtron tools to support 200mm production
SiC specialist Wolfspeed has placed multiple-tool orders in Q3 and Q4 2023 to utilise Aixtron's G10-SiC to help further ramp production for 200mm (8-inch) SiC epitaxial wafers.
Samsung to receive $6.4B Chips Act boost for Texas fab
The Biden administration will award Samsung Electronics with up to USD 6.4 billion in direct funding to expand the company's semiconductor production in Texas as part of the CHIPS and Science Act.
FPT says its “all In” on AI, automotive and semiconductors
FPT Corporation has unveiled its strategic directions for the 2024-2026 period, with five focused areas defined as AI, Automotive, Semiconductor, Digital Transformation, and Green Transformation.
ODU names new managing director
Connector solutions manufacturer ODU has appointed Dr. Henner Spelsberg as its new Managing Director and Spokesman of the Management Board. He will assume the responsibilities of his predecessor, Dr.-Ing. Kurt Woelfl.
IT breach at Nexperia
Nexperia says that it has become aware that an unauthorised third party accessed certain of its IT servers in March 2024.
Exyte acquires Kinetics Group
Exyte says it plans to acquire Kinetics Group, a global provider of installation services, equipment, as well as technical facility management.
Qualcomm drops bid to buy Autotalks
Qualcomm has terminated its deal to acquire Israeli V2X communications company Autotalks.
ERS and Geringer to strengthen R&D and production capabilities
ERS electronic, a thermal management solutions specialist for semiconductor manufacturing, has finalised an agreement with Geringer Halbleitertechnik GmbH & Co. KG, a move poised to bolster its R&D and production capabilities.
JDI completes the sale of Higashiura fab to Sony
Back in March last year, Japan Display Inc (JDI) announced that it was going to sell its Higashiura fab facilities. The company has now completed the sale of the former Higashiura fab facilities to Sony Semiconductor Manufacturing Corporation (SCK).
Microchip acquires Neuronix AI Labs
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
Kyocera AVX breaks ground on new facility
Kyocera AVX new 49,000-square-foot manufacturing and design center will allow the company to produce millions of precision timing and frequency control products.
Apple to supercharge Mac range with AI-optimised M4 chip
Apple is preparing for a major overhaul of its laptop and desktop line-up by powering them with its new M4 chipset, which prioritises AI applications.
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