Zürich | April 23, 2026

More powerful laser sources and optimized processes are driving a continuous increase in performance in laser depaneling. This progress is enabled not only by higher output power, but also by very short pulse durations and ultra-fast beam deflection technologies, such as the patented LPKF Tensor technology. As a result, the price–performance ratio continues to improve, while the range of economically viable applications is steadily expanding.

Laser depaneling now stands out not only for its technological advantages—such as high precision, stress-free processing, and low dust generation—but also for its strong economic efficiency. This presentation explores how performance has improved through increased laser power and the integration of advanced deflection technologies, and how the full potential of laser depaneling can be unlocked through targeted measures, for example minor design optimizations. The impact of higher laser power and beam deflection technologies on expected temperatures near the cutting channel, as well as their relevance for SAC and LTS solder alloys, will also be addressed.

Lines and spaces down to 18 µm can be realized in advanced subtractive processes, which is already beyond industry standard of around 50 µm. Moving forward to additive plating technology, finer structure features below 10 µm can be achieved. To fully benefit from the miniaturization advantages, related processes such as via size, material thickness, alignment accuracy and adhesion must be considered. We discuss specific applications where fine-line subtractive and semi-additive plating (SAP) offers significant advantages, such as in the production of flexible electrodes, passive structures, substrates for fine-pitch ultrasound transducers, and miniaturized components. Additionally, we analyze the challenges faced in implementing SAP for such applications, including available fabrication process options, cost considerations, and strategies to overcome the challenges of high-mix, low-volume production.

The global memory market is undergoing a paradigm shift. Once viewed as a commoditised, cyclical market, memory is now increasingly shaped by AI-driven demand concentration, geopolitical realignment, and unprecedented capital intensity. The result is that legacy and advanced memory are both experiencing shortages, but for entirely different reasons.

In this session, Nick Florous provides a clear, application-centric, and fact-based outlook on the global memory market—moving beyond short-term noise to explain the structural forces redefining supply, pricing, and investment behaviour. 

With every increasing performance requirements for PCBs, advanced copper foils and glass weaves are needed in addition to improved resin systems.

More stringent requirements within the European Union (REACH, SVHC listings, PFAS) are to be considered when selecting base materials for a given application.

Due to geopolitical changes, especially the military, space and aerospace segments are re-considering and looking for European suppliers. 

In addition, supply chain disturbances during and after CoVID reminded the industry of the dangers of being dependent on Greater China.

With the exit of two more base material suppliers from European production, there is only one remaining laminate and one remaining copper foil producer in Europe.

Alexander Ippich in his speech is going to show, how all those requirements can be addressed.

Claus Aasholm, founder of Semiconductor Business Intelligence and a seasoned semiconductor strategist, will join Evertiq Expo to deliver a fact-based examination of the global semiconductor industry.

Known for his precise analytical approach and proprietary data models, Claus focuses on the metrics that truly define the market: capacity expansion, capital investments, supply-chain shifts, labour dynamics, regional policy effects, and real utilisation patterns across the value chain.

Rather than following industry narratives, he dissects the underlying data that exposes structural change, reveals actual areas of growth, and challenges assumptions often repeated in corporate and policy circles. His analysis aims to provide clarity in a sector shaped by geopolitical intervention, aggressive capital deployment, and accelerating technological requirements.

Time is one of the most valuable and non-renewable resources. The Cadence AI solution helps design teams significantly shorten their design cycles while making extensive optimizations in advance. AI-powered PCB design enables fast, informed decisions, increasing productivity many times over.

This allows designers to focus on the tasks that really make a difference, while AI takes care of the rest.

Electronic systems are expected to deliver increasing functionality while becoming smaller and lighter. Conventional PCB technologies are reaching their physical and technical limits in meeting these demands. Embedding passive components and active bare dies directly into multilayer PCBs and modules provides a promising path towards higher functional density, improved electrical performance, and reduced assembly height without increasing the footprint.

Cicor has developed an advanced embedding technology that integrates ultra-thin bare dies and passive components within high-density multilayer substrates. The presentation outlines the manufacturing concept and its potential to enable next-level miniaturization in advanced electronic applications.

In many organisations, conformal coating and dispensing are still associated with added process complexity, long setup times, demanding programming and increased production risk. But under which conditions can these processes be implemented in a stable, efficient and economically viable way?

This presentation explores how perceived complexity can be reduced through clear process design and proven best-practice approaches. Using practical examples, it shows how automation, material selection, component protection and programming can be managed in a controlled and repeatable manner.

A special highlight of the session will be a live audio interaction with an intelligently controlled Protecto coating system from Rehm Thermal Systems. This demonstration illustrates how modern equipment can increase process transparency and support operators in day-to-day production.

After the presentation, participants are invited to join an interactive deep dive and address their questions directly to the speaker – or to the system.