Vienna | January 28, 2027

Austria's New Electronics Expo

Est. 2027

The conference program run parallel with the Expo. Feel free to visit any of the sessions when you register for Evertiq Expo. If you wish to participate, please contact
  • 09:00 - 09:30
    Cost-effectiveness in testing – what does it cost not to test?
    Matthias Kubli - Managing Director - Kubes AG

    Why, in fact, do we test what we test? Who decides on the scope and depth of testing? And what would happen if we omitted individual tests or did away with them altogether?

  • 09:35 - 10:05
    TBA
    Fahir Veladzic - CEO & Founder - Chipsocnnect
  • 10:10 - 10:40
    A Fairy Tale of FR4 materials, supply chains and optimization
    Jürgen Braunsteiner - Board Member - FED e.V.

    Rising demand, declining inventories, longer lead times, and the first allocation programs are tightening the supply of FR4 base materials. This presentation explains why companies should now critically review their PCB procurement strategies and manufacturing specifications. Using practical examples — from optimized panel layouts and the acceptance of X-outs to scored outlines and alternative material specifications — participants will learn how to reduce material consumption, scrap, and costs while improving supply security and flexibility. The focus is on open collaboration with PCB manufacturers to develop viable solutions even under challenging market conditions.

  • 10:45 - 11:45
    TBA
    Dieter G. Weiss - in4ma
    Mareike Haass - in4ma
  • 11:50 - 12:20
    TBA
    Mira Grünhaupt - Head of Solution Advisory - PAILOT
  • 12:25 - 12:55
    Thinner, finer, more powerful? – mSAP as a key technology for next-generation PCBs
    Paul Rüdiger - CEO & Owner - RPtec

    Modified Semi-Additive Process (mSAP) technology enables the fabrication of ultra-fine circuit traces and provides a key foundation for modern high-density printed circuit boards. This presentation introduces the technical principles of the process and explains the material requirements involved. Special attention is given to ultra-thin copper foils, including Nanotus copper foil, which is designed for demanding mSAP applications. Selected application examples demonstrate the requirements that next-generation electronic products place on materials and manufacturing processes. The presentation also discusses the relationship between material properties, process control, and the achievable quality of fine-line circuitry. It is intended for technical professionals seeking a practical overview of the opportunities and challenges associated with mSAP technology.

  • 13:00 - 13:30
    TBA
  • 13:35 - 14:15
    TBA
    Memphis Electronic
  • 14:20 - 14:50
    800-Volt Systems: A key technology in power electronics and their EMC challenges
    Dominik Zeller - Würth Elektronik

    800-volt systems are becoming increasingly important in modern power electronics, as they enable higher efficiency, lower losses, and more compact system designs. Particularly in applications such as e-mobility and industrial energy systems, they are driving innovation and increasing power density.

    At the same time, higher voltages and faster switching speeds significantly increase electromagnetic compatibility (EMC) requirements. This presentation explores the technical relevance of 800-volt architectures, typical EMC challenges encountered during the design process, and practical approaches to ensuring EMC compliance through the use of 800 V filters.

  • 14:55 - 15:25
    TBA
  • 15:30 - 16:00
    TBA
    Ewelina Bednarz - Content Manager - Evertiq

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