Vienna | January 28, 2027

Modified Semi-Additive Process (mSAP) technology enables the fabrication of ultra-fine circuit traces and provides a key foundation for modern high-density printed circuit boards. This presentation introduces the technical principles of the process and explains the material requirements involved. Special attention is given to ultra-thin copper foils, including Nanotus copper foil, which is designed for demanding mSAP applications. Selected application examples demonstrate the requirements that next-generation electronic products place on materials and manufacturing processes. The presentation also discusses the relationship between material properties, process control, and the achievable quality of fine-line circuitry. It is intended for technical professionals seeking a practical overview of the opportunities and challenges associated with mSAP technology.

800-volt systems are becoming increasingly important in modern power electronics, as they enable higher efficiency, lower losses, and more compact system designs. Particularly in applications such as e-mobility and industrial energy systems, they are driving innovation and increasing power density.

At the same time, higher voltages and faster switching speeds significantly increase electromagnetic compatibility (EMC) requirements. This presentation explores the technical relevance of 800-volt architectures, typical EMC challenges encountered during the design process, and practical approaches to ensuring EMC compliance through the use of 800 V filters.