The EU Digital Product Passport (DPP) is a cornerstone of the European Union’s sustainability initiatives under the Green Deal and Circular Economy Action Plan. This innovative framework aims to increase transparency and traceability across product lifecycles by digitally capturing critical information about materials, sustainability, and regulatory compliance.

This presentation will provide a comprehensive overview of the DPP’s scope, identifying the industries and stakeholders it impacts—ranging from consumer electronics to automotive and industrial equipment—and outlining the expected implementation timelines. Special attention will be given to its intersection with prohibited substance regulations such as REACH and RoHS, highlighting the DPP’s role in ensuring material compliance and fostering circularity.
As a service provider specializing in material compliance, we will discuss practical strategies for managing the challenges posed by the DPP, including the complexities of data collection, prohibited substance tracking, and adherence to EU sustainability standards.

Finland's semiconductor industry is poised for significant growth, leveraging its specialized expertise, robust R&D ecosystem, and innovative infrastructure. Home to over 90 companies across the value chain, Finland excels in niche areas such as chips design, advanced materials, process technologies, MEMS and sensors, photonics, and quantum technologies​.

The Chips from the North strategy, released in 2024, sets ambitious targets to triple industry revenue to €5–6 billion by 2035, and create 15,000 new jobs. Finland’s strengths, including leading positions in mobile network expertise, position the country as a key contributor to Europe’s semiconductor resilience under the EU Chips Act.

This presentation will showcase Finland’s growth opportunities, its role in the global value chain, and how the nation’s collaborative public-private approach fuels innovation and international partnerships. Discover how Finland’s forward-looking strategy supports sustainable, next-generation semiconductor solutions.

For many years cybersecurity was an area primarily affecting the enterprise computing market, and corporate PCs and datacenters were the main targets for malware attacks. This is no longer the case and in recent years there’s has been a massive increase of malicious attacks on embedded and IoT devices, while the cybersecurity domain was largely ignored by embedded device manufacturers. This is now changing, and EU’s new Cyber Resilience Act introduces mandatory cybersecurity requirements on all suppliers of products containing “a digital component”. This presentation takes a brief look into the impact of these new regulations on the technical requirements for embedded hardware and software as well as company processes.

In 2023, Evertiq took a significant step in supporting emerging talent in the electronics industry by launching the Evertiq Scholarship. The initiative, introduced at Evertiq Expo Tampere, aimed to recognise and encourage promising students who show exceptional potential and dedication to the field. Now, the scholarship returns.

Rigid-flex printed circuit boards were originally developed for military and aerospace applications. Today this technology can be found in all industries and applications where miniaturization and reliability are important, not least due to the introduced standardizations of the technology and also the advances in plant and process technology.

This presentation gives an overview of what is „reliablity“ and takes a depper look into the system analysis, design and material choice for FLEX.rigid applications in harsh environmental conditions.