Malmo | May 15, 2025

Embedded software is in virtually all the products we come in contact with every day. For example, there are 100+ million lines of code in automotive, 24% of Medical device recalls are due to software issues, and there's 15.4% growth in the software driven "Smart Appliance" market. As a result, the use of embedded software is quickly infringing on hardware’s dominance in the product development process.

However, in many environments’ software development is a siloed activity that leads to disconnects between product requirements and implementation that leads to product recalls or product failures. In legacy software development environments, many different point solutions are used to manage the application lifecycle. As a result, development artifacts are scattered, slowing down collaboration, hindering transparency, undermining integrity and making it difficult to drive innovation.

 This presentation will cover the challenges in today’s embedded software development and how a unified solution can help organizations with project transparency from requirements to test throughout the project lifecycle.  The presentation will also show how it’s possible to work with different stakeholders like clients and managers and with those that are in the project so that everybody has a real-time view of the status of the project.

Abstract: Perception and sensing of the surrounding environment are crucial for ensuring the safety of autonomous driving systems. A key issue is securing sensor reliability from sensors mounted on the vehicle and obtaining accurate raw data. Surface contamination in front of a sensor typically occurs due to adverse weather conditions or particulate matter on the road, which can degrade system reliability depending on sensor placement and surrounding bodywork geometry. Moreover, the moisture content of dust contaminants can cause surface adherence, making it more likely to persist on a vertical sensor surface compared to moisture only. In this work, a 76–81 GHz radar sensor, a 72–82 GHz automotive radome tester, a 60–90 GHz vector network analyzer system, and a 76–81 GHz radar target simulator setup were used in combination with a representative polypropylene plate that was purposefully contaminated with a varying range of water and ISO standard dust combinations; this was used to determine any signal attenuation and subsequent impact on target detection. The results show that the water content in dust contaminants significantly affects radar signal transmission and object detection performance, with higher water content levels causing increased signal attenuation, impacting detection capability across all tested scenarios.

The miniaturisation of highly integrated flexible printed circuit boards (PCBs) is a critical advancement in modern electronics, driven by the demand for smaller, more efficient devices. This talk explores the use of a semi-additive process (SAP) to achieve fine structures with line and space dimensions as small as 15 µm. The SAP technique offers significant advantages in artwork precision, making it ideal for high-density applications. SAP technology enables smallest line/space structures, and therefore a small pitch not possible with conventional subtractive technology. Miniaturisation through additive processes imposes new requirements on existing quality inspections and equipment technology. Dyconex discusses challenges and developments to support the continued miniaturisation of PCB substrates, ensuring both high performance and reliability in future electronic devices.