Malmo | May 15, 2025

Embedded software is in virtually all the products we come in contact with every day. For example, there are 100+ million lines of code in automotive, 24% of Medical device recalls are due to software issues, and there's 15.4% growth in the software driven "Smart Appliance" market. As a result, the use of embedded software is quickly infringing on hardware’s dominance in the product development process.

However, in many environments’ software development is a siloed activity that leads to disconnects between product requirements and implementation that leads to product recalls or product failures. In legacy software development environments, many different point solutions are used to manage the application lifecycle. As a result, development artifacts are scattered, slowing down collaboration, hindering transparency, undermining integrity and making it difficult to drive innovation.

 This presentation will cover the challenges in today’s embedded software development and how a unified solution can help organizations with project transparency from requirements to test throughout the project lifecycle.  The presentation will also show how it’s possible to work with different stakeholders like clients and managers and with those that are in the project so that everybody has a real-time view of the status of the project.

Abstract: Perception and sensing of the surrounding environment are crucial for ensuring the safety of autonomous driving systems. A key issue is securing sensor reliability from sensors mounted on the vehicle and obtaining accurate raw data. Surface contamination in front of a sensor typically occurs due to adverse weather conditions or particulate matter on the road, which can degrade system reliability depending on sensor placement and surrounding bodywork geometry. Moreover, the moisture content of dust contaminants can cause surface adherence, making it more likely to persist on a vertical sensor surface compared to moisture only. In this work, a 76–81 GHz radar sensor, a 72–82 GHz automotive radome tester, a 60–90 GHz vector network analyzer system, and a 76–81 GHz radar target simulator setup were used in combination with a representative polypropylene plate that was purposefully contaminated with a varying range of water and ISO standard dust combinations; this was used to determine any signal attenuation and subsequent impact on target detection. The results show that the water content in dust contaminants significantly affects radar signal transmission and object detection performance, with higher water content levels causing increased signal attenuation, impacting detection capability across all tested scenarios.

The miniaturisation of highly integrated flexible printed circuit boards (PCBs) is a critical advancement in modern electronics, driven by the demand for smaller, more efficient devices. This talk explores the use of a semi-additive process (SAP) to achieve fine structures with line and space dimensions as small as 15 µm. The SAP technique offers significant advantages in artwork precision, making it ideal for high-density applications. SAP technology enables smallest line/space structures, and therefore a small pitch not possible with conventional subtractive technology. Miniaturisation through additive processes imposes new requirements on existing quality inspections and equipment technology. Dyconex discusses challenges and developments to support the continued miniaturisation of PCB substrates, ensuring both high performance and reliability in future electronic devices. 

Sweden is stepping up to strengthen its role in the global semiconductor industry. With the Semicon Sweden initiative, industry leaders, researchers, and academics are coming together to build a dynamic ecosystem focused on boosting capacity, knowledge, and innovation across the entire semiconductor value chain.

This session showcase concrete efforts and success stories from multiple angles—like how Ericsson is using semiconductor technology in its radio networks, a startup company’s journey from research to market, and the development of Swedish research infrastructure and pilot lines.

Participants will gain insight into how the Swedish Chip Competence Center (SCCC) functions as a hub for semiconductor expertise, bringing together companies, researchers, and innovators with cutting-edge technology, education, and support. The industry association Svensk Elektronik will share how it's pushing strategic initiatives to boost Sweden’s global competitiveness. In addition, the international project ElektroLink will be introduced, aiming to open up new business opportunities and raise Sweden’s profile across Europe.

In electronics the circular economy embodies strategies to extend product lifecycles & promote reuse. Factronix is a company that has extensive experience in this field, so during the speech it will talk about what related services are important and why.

The lecture will therefore focus on issues such as Component Recovery, Laser Reballing, Retinning, Test Services, that is, services which involve giving a second life to electronic components that would otherwise be discarded, turning potential waste into valuable resources.

The well-known four-year ebb and flow of the semiconductor industry is over. Political decisions and ambitions challenge the economic logic of supply and demand. Subsidies, embargoes and the AI revolution are now dictating the investment decisions while China plays the long game. Get ready for a one-hour chart attack from Semiconductor Business Intelligence.
 

Sweden is at a turning point – how can we secure our place in the global semiconductor landscape? In this panel discussion, voices from industry, academia, and research come together to explore Sweden’s potential and role in the semiconductor sector. How can we better highlight our strengths? And what needs to happen for a strong and sustainable Swedish semiconductor sector to take shape?