Lund | May 21, 2026

Embedded software is in virtually all the products we come in contact with every day. For example, there are 100+ million lines of code in automotive, 24% of Medical device recalls are due to software issues, and there's 15.4% growth in the software driven "Smart Appliance" market.

As a result the use of embedded software is quickly infringing on hardware’s dominance in the product development process. However in many environments software development is a siloed activity that leads to disconnects between product requirements and implementation that leads to product recalls or product failures. In legacy software development environments, many different point solutions are used to manage the application lifecycle. As a result, development artifacts are scattered, slowing down collaboration, hindering transparency, undermining integrity and making it difficult to drive innovation.

This presentation of Polarion Application Lifecycle Management will cover the challenges in today’s embedded software development and how Polarion can help organizations with a unified solution that divers project transparency through real-time aggregated management information. Polarion enables everyone to be aligned around what is being built and why, to drive advancement while protecting integrity and compliance. Polarion helps teams respond faster and with better quality to new business opportunities and customer demands.

The presentation will also show how it’s possible to work with different stakeholders like clients and managers together with projectmembers so that everybody has a real-time view of the status of the project.

Europe is investing heavily in AI software, chips, and data infrastructure. However, AI systems ultimately depend on advanced hardware, and hardware depends on high-performance printed circuit boards. Without secure and scalable PCB manufacturing, AI sovereignty remains incomplete.

This keynote will address why advanced multilayer, HDI, and high-reliability PCB capacity is a strategic layer of the AI value chain. I will outline current structural gaps in Europe’s electronics ecosystem, the risks of offshore dependency, and what rebuilding modern PCB manufacturing means in practical terms: technology, scale, automation, sustainability, and defense-grade resilience.

If Europe wants AI sovereignty, it must rebuild the physical foundation beneath it.

How do you know which thermal interface material is right for your application? In this presentation, Promoco shares a practical and systematic approach to selecting the right solution when a component requires cooling.

The session begins with how to define and dimension cooling requirements, followed by a review of the key factors that influence material selection – such as thermal conductivity, hardness, compression, tolerances, electrical insulation and suitability for production. Participants will receive concrete, step-by-step guidance on how to reason their way toward a well-founded material choice.

The second part of the presentation focuses on a comparison between thermal greases and thermal pads, highlighting the advantages and limitations of each from both a functional and a manufacturing perspective.

Finally, the presentation also addresses combination solutions, such as laminated thermal interface materials, Mylar and metal foils, and explains how these can help reduce production steps and improve ease of use.

The presentation is based on real-world examples from industrial applications.

To be announced at a later stage

Claus Aasholm, founder of Semiconductor Business Intelligence and a seasoned semiconductor strategist, will join Evertiq Expo to deliver a fact-based examination of the global semiconductor industry.

Known for his precise analytical approach and proprietary data models, Claus focuses on the metrics that truly define the market: capacity expansion, capital investments, supply chain shifts, labour dynamics, regional policy effects and real utilisation patterns across the value chain.

Rather than repeating industry narratives, he examines the underlying data that reveals structural change, exposes real areas of growth and challenges assumptions often repeated in corporate and policy environments. His analysis is designed to bring clarity to a sector shaped by geopolitical intervention, significant capital deployment and rising technological requirements.

According to a study by Greenpeace, the semiconductor industry is projected to consume 237 terawatt hours (TWh) of electricity by 2030. Available power is already under a lot of strain due to the large consumption from other industries – such as data centers. This reality presents a large risk to an already sensitive value chain.

Cooling water systems alone are estimated to account for 5–40% of total energy consumption in semiconductor manufacturing. By optimizing these systems, a significant amount of waste heat can be recovered and repurposed, rather than lost to the environment.

Over the past year, leading industry players have begun implementing various energy saving strategies, including heat recovery from UPW & PCW systems, chiller bypass strategies and sector coupling to name a few. By doing so, foundries can reduce both OPEX and environmental impact.

The rapid expansion of district heating networks across Europe presents a unique opportunity to put recovered waste heat to good use, supplying clean thermal energy to local communities and industries. Strategies successfully deployed in other sectors—such as data centers and heavy industry—are now being adapted for the semiconductor industry, demonstrating the value of cross-industry collaboration and knowledge transfer.

This presentation will explore thermal management opportunities for the semiconductor industry, cases from leading foundries, and collaboration opportunities with other sectors. Together these strategies represent a holistic approach in ensuring that the semiconductor industry remains competitive and environmentally responsible in the years to come.

Obsolescence management is a growing challenge in the semiconductor industry, driven by accelerated lifecycles and aging mechanisms like corrosion and material degradation. This presentation explores the root causes of obsolescence, highlighting the importance of understanding these aging effects for long-term storage. Key factors include optimal environmental conditions, quality assurance, and lifecycle monitoring to preserve component integrity. By implementing targeted storage strategies, manufacturers can mitigate obsolescence risks, reduce disruptions, and extend component lifespan, ensuring reliability and regulatory compliance in long-life markets such as aerospace, defense, and medical applications.
 

What does the Swedish electronics manufacturing landscape look like today? This presentation examines the Top 20 EMS providers in Sweden based on the latest available revenue data. Expanding last year’s analysis, the session highlights changes in the ranking, regional clusters, and key market segments, offering an updated snapshot of the Swedish EMS industry.