Berlin | June 18, 2026

In electronics manufacturing, highly complex dependencies converge every day: workforce capacity, machine availability, changeover times, material shortages, and last-minute schedule changes. Yet in many factories, detailed scheduling is still managed through Excel sheets, ad-hoc coordination and improvisation — with familiar consequences: limited transparency, unstable processes, missed delivery deadlines and increasing pressure on teams.

This talk explains how AI-supported advanced scheduling can turn complexity into control, and why implementing intelligent planning systems should not be approached as a purely IT-driven initiative, but as a company-wide transformation.

Key questions addressed include:

* Which structural challenges shape advanced scheduling in electronics manufacturing?

* How do evolutionary algorithms outperform classical heuristics — in real-world production environments?

* Which cultural and organisational prerequisites are critical for successful implementation?

Using the practical case study of Fritsch Elektronik, the presentation demonstrates how a mid-sized electronics manufacturer achieved measurable improvements in on-time delivery, resource utilisation and production stability through AI-based scheduling.

The global memory market is undergoing a paradigm shift. Once viewed as a commoditised, cyclical market, memory is now increasingly shaped by AI-driven demand concentration, geopolitical realignment, and unprecedented capital intensity. The result is that legacy and advanced memory are both experiencing shortages, but for entirely different reasons.

In this session, Nick Florous provides a clear, application-centric, and fact-based outlook on the global memory market—moving beyond short-term noise to explain the structural forces redefining supply, pricing, and investment behaviour. 

Electronic systems are expected to deliver increasing functionality while becoming smaller and lighter. Conventional PCB technologies are reaching their physical and technical limits in meeting these demands. Embedding passive components and active bare dies directly into multilayer PCBs and modules provides a promising path towards higher functional density, improved electrical performance, and reduced assembly height without increasing the footprint.

Cicor has developed an advanced embedding technology that integrates ultra-thin bare dies and passive components within high-density multilayer substrates. The presentation outlines the manufacturing concept and its potential to enable next-level miniaturization in advanced electronic applications.