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TEC PROGRAM


  • Between 09:00 and 16:00 you are invited to attend our table-top exhibition as well as listen to interesting stage presentations.
  • The stage program will run parallel to the exhibition. Feel free to attend the sessions that you are most interested in.
  • Lunch will be served between 12:00 and 14:00.
  • Beverages and snacks are served in our buffet areas throughout the day.


Moderator: Konrad Bruliński, Evertiq.pl

  • 09:00 - 09:30
    Research & Development Centers: support possibilities from Inteligentny Rozwój 2014 - 2020 EU programm
    Patrycja Zeszutek - Vice Director at Innovation and Development Support Programs - Ministry of Investment and Development
  • 09:30 - 10:00
    Designing printed circuits for EMC electromagnetic compatibility
    Wojciech Mućka - Projektant - Kompania Elektroniczna
    The lecture will cover the issue of minimising the disturbances emitted by paths and current loops on the printed circuit boards. We will show good and bad examples of EMC projects and discuss the use of passive elements to suppress EMC interference.
  • 10:00 - 10:45
    Electronics production in Poland and the CEE region
    Peter Brent - Consultant - Reed Electronics Research
    Poland is a leading country for electronic production and with the developing trends brought on by faster time to market and shortening the supply chain, manufacturers are turning towards "making in the region for the region". Additionally, the competitive European EMS industry is driving more Western EMS companies to manufacture more in their factories in CEE or begin new investment here to meet fierce industry pricing demands. The presentation will focus on electronic production both OEM and EMS manufacturing in Poland and other CEE countries, drawing comparison with the manufacture elsewhere in Western Europe, and examine the issues and trends especially in the faster growing sectors of automotive, industrial, control and instrumentation
  • 10:45 - 11:15
    Modern selective soldering techniques in the production of High-Mix / Low-Volume
    Harald Grumm - ERSA
    Newest trends, technologies and solutions in solder paste printing and 3D inspection from leading equipment producers
  • 11:15 - 12:00
    Protecting electronics - advantages and disadvantages of methods and materials used
    Rafał Przegaliński - Technical Sales Support Specialist - C.H.Erbsloeh
    Overview of basic methods and materials to protect the components, pcb, electronics - conformal coating, glob top, potting, hot melt with particular focus on advantages and disadvantages of the various materials used in the manufacturing process.
  • 12:00 - 12:30
    Technical trends in the global PCB industry
    Tomasz Ostrowski - Technical Manager - NCAB
    A presentation of the technical challenges, expectations and trends going forward in the PCB industry. 
  • 13:00 - 13:30
    Bluetooth 5 - a new version of the standard in new applications
    Maciej Michna - Development Manager - Nordic Semiconductor
    The new Bluetooth 5 standard provides us with four new enhancements which will ease the introduction of Bluetooth into new applications. Long range, increased data rate, wireless coexistence and advertising extensions are the tools that will help creating new IoT scenarios and make current use-cases more functional. During the lecture these four features will be presented along with new opening possibilities for the new Internet of Things applications of the future
  • 13:30 - 14:00
    Simulation software and instruments for measuring electromagnetic fields
    Jarek Kwiatkowski - WAVE-TEST
    The designers and manufacturers of advanced electronics are increasingly boldly enjoying the benefits of high-frequency technology using higher and higher operating frequencies of digital circuits, equipping designed devices with wireless interfaces, using sensors based on electromagnetic effects or using electromagnetic radiation directly eg to obtain the thermal effects. In addition to the obvious benefits such as increasing the speed of devices, expanding the capacity of the channels and avoiding the troublesome cable connections this approach leads also to the emergence of a number of potential threats and design challenges. The most common ones include the problems of "signal integrity" and "power integrity" in digital PCBs, interferences and crosstalks inside devices, problems in the area of electromagnetic compatibility and problems related to health exposure caused by EM fields radiating the human body. Some of them can be effectively eliminated at the virtual design stage and all of them by measuring the properties of the physically implemented device. 
  • 14:00 - 14:30
    66/5000 Overview of battery power technology for selected applications
    Krzysztof Lubianiec - Wamtechnik
    Power supply sources technologies for industrial and commercial electronics: split according to technologies and parameter description for main power sources. New trend for power supply: EV, mass commercial electronics, renewable energy and ESS storage.
  • 14:30 - 15:00
    Types of ESD floors used in production and assembly of electronics
    Maciej Knuth - Product Manager - Milar
    Construction, technologies, exploitation (durability and conservation) of contemporary ESD floor systems. Presentation will comprise also standards and conductance measurements. Summary advantages and disadvantages of particular solutions regarding surrounding conditions and users' requirements.

Contact

Sales
Łukasz Jaeszke
+48 609 130 180
Project Manager
Anders Björsell
+46 70 560 91 91
Conference Program
Łukasz Jaeszke
+48 609 130 180