XTPL with EU support for photonics and AI technology

Company XTPL S.A. has received funding from the European Union for a project on the integration technology of photonic integrated circuits for applications in artificial intelligence. The project involves developing a new printing system for connecting photonic and electronic circuits in advanced packaging processes. The technology is intended for use in the microelectronics sector, data centers, and telecommunications infrastructure utilizing advanced optoelectronic modules. The company stated that the project plans comprehensive research and development work on material flow mechanisms and precision dosing, enabling the creation and validation of a high-performance, multi-nozzle print head, including the integration of an intelligent machine learning-based automation system into a complete production platform. The developed system is expected to enable ultra-precise creation of conductive interconnections below 10 micrometers in width on complex 3D surfaces, and will be offered to customers in Poland and abroad. The total project value is PLN 18.29 million, with EU funding exceeding PLN 10.09 million