Soitec CEO: we could build a US facility
April 15, 2024
French semiconductor materials company Soitec is weighing up the benefits of constructing a factory in the US in a bid to be near to its key customers.
Pragmatic opens the UK's first 300mm wafer manufacturing fab
March 27, 2024
Pragmatic Semiconductor has officially opened the UK's first 300mm semiconductor wafer fabrication line at Pragmatic Park in Durham.
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Siemens to acquire business unit from ebm-papst
March 26, 2024
Siemens AG has signed an agreement to acquire the industrial drive technology (IDT) business of ebm-papst.
Sequans bags EUR 10.9m France 2030 grant
March 25, 2024
The French government has pledged a EUR 10.9m subsidy to cellular IoT chipmaker Sequans Communications to bolster's France's position in the 5G telecoms space.
MediaTek partners with Ranovus to enter the CPO market
March 25, 2024
Taiwanese chip firm MediaTek is making a move into the field of Heterogeneous Integration Co-Packaged Optics (CPO) via a partnership with optical communications firm Ranovus.
Silicon Mountain invests in Universal Instruments Fuzion system
March 21, 2024
EMS provider Silicon Mountain has recently invested in a new Universal Instruments Fuzion system. The move significantly enhances the company’s manufacturing capabilities.
Incap Slovakia invests in new production machinery
March 20, 2024
EMS provider Incap has upgraded its second SMT production line in Slovakia, replacing it with advanced SMT machinery.
Essemtec delivers 40th machine to Zollner
March 19, 2024
Earlier this year, Essemtec AG reached a milestone with the delivery its 40th machine to EMS provider Zollner Elektronik AG.
ASML invests in EUR 110m fund to support deeptech startups
March 18, 2024
Dutch lithography firm ASML is supporting its home country by supporting the Eindhoven-based DeepTechXL fund. It invests in firms doing work in quantum, photonics and other complex engineering fields.
Singaporean researchers develop ultra-thin wearable chips
March 15, 2024
A team at Nanyang Technological University, Singapore (NTU Singapore) has successfully fabricated a hair-thin semiconducting fibre that can be woven into fabrics to create wearable electronics.
Micro LED Apple Watch production faces significant changes
March 14, 2024
In a surprising twist, LED giant ams OSRAM has called off a significant Micro LED collaboration with Apple, casting substantial uncertainty on the launch of the much-anticipated Micro LED version of the Apple Watch as its sole chip supplier.
onsemi form new business group – target $19.3 billion market
March 13, 2024
onsemi has formed the Analog and Mixed-Signal Group (AMG), which will be led by newly appointed group president Sudhir Gopalswamy, as the company looks to expand its portfolio of power management and sensor interface devices to unlock an additional USD 19.3 billion total addressable market.
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Green Circuits enhances capabilities with new machinery
March 06, 2024
San Jose-based EMS provider, Green Circuits, has expanded its capabilities with the acquisition of an iCoat-5 JetSelect Ultra High Precision Conformal Coating Machine from Anda Technologies
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EU's Edge-AI body now accepting design proposals
March 01, 2024
The European Union has issued a call for proposals to its PREVAIL consortium, which was set up to accelerate the development of next-generation, edge-AI technologies across the continent.
Confidee approved by Terma A/S
February 28, 2024
PCB supplier Confidee has made its way into Danish Termas list of approved suppliers.
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Triad Semiconductor launches dedicated defence division
February 09, 2024
US-based Triad Semiconductor has launched Triad Micro Devices (TMD), a new unit dedicated to developing analog and mixed-signal integrated circuits for the aerospace and defence industries.
NEOTech expands centre for microelectronics
January 31, 2024
EMS provider NEOTech has expanded its manufacturing centre for Microelectronics in Chatsworth, California, as the need for reliable and complex Micro-E circuits continues to grow.
Fujifilm starts production of CMP slurries in Japan
January 26, 2024
Japanese conglomerate Fujifilm has opened its fourth CMP slurries production facility. The new site is located in Kumamoto on Kyushu island.
Intel opens US's first advanced packaging fab
January 25, 2024
Intel has formally opened its Fab 9 factory in New Mexico. It describes the plant as its first high-volume chip operation and the only US factory producing advanced packaging solutions at scale.
Poro and PSMC form strategic partnership on MicroLEDs
January 25, 2024
UK-based Poro Technologies and Taiwan’s Powerchip Semiconductor Manufacturing Corp will team up to mass produce the MicroLEDs on 200mm GaN-on-silicon for display applications.
Amber Group and Korea Circuit sign supply agreement on PCBs
January 24, 2024
India's Amber Group and South Korea’s Korea Circuit have signed an MOU to manufacture high density interconnect and semiconductor substrate PCBs.
Sondrel reveals 50 billion transistor chip design
January 24, 2024
UK-based Sondrel has successfully completed an ultra-complex design on a 5nm process node.
Making the right materials choices for your PCB
January 23, 2024
PCBs are the backbone of electronic devices, providing the foundation for nearly every electronic product you encounter regularly. Consequently, choosing the right materials for PCBs is a critical step in the design process that will directly impact the performance, reliability, and longevity of the end product.
Enablence and Polar Semiconductor form strategic partnership
January 22, 2024
The two North American companies will come together to develop optical semiconductors for transceiver customers all over the world.
LCY Group invests $9.5 million in DENKAI America
January 19, 2024
Taiwanese industrial giant LCY Group has made a USD 9.5 million loan to DENKAI America to expand its presence in the US.
Jabil to scale development and production for Revolut
January 16, 2024
Electronics manufacturer Jabil and Revolut have been collaborating since 2021 to diversify the digital banking company’s product portfolio, including the launch of Revolut Reader, a compact, custom hardware platform that enables merchants to accept in-store or on-the-go payments. Now It’s time to scale manufacturing.
Chinese team presents 256-core multi-chiplet 'big chip'
January 05, 2024
Researchers at the Chinese Academy of Sciences believe they have made a major breakthrough – a chip combining 16 chiplets, each holding 16 RISC-V cores, interconnected via network-on-chip.
Amber Group buys 60% stake in Ascent Circuits
January 05, 2024
India's Amber Group has acquired a majority share of printed circuit board firm Ascent in a bid to strengthen its electronic manufacturing services (EMS) portfolio.
Scientists reveal first functional graphene semiconductor
January 05, 2024
After many years of speculation, it appears that researchers have successfully developed a chip based on the 'wonder material' graphene.
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