Silvaco files for IPO, closes deal with Micron
April 19, 2024
Silvaco Group has agreed an enhanced partnership with Micron just a few days after filing for a $100m initial public offering on the Nasdaq Global Market.
SK hynix and TSMC to collaborate on HBM4 innovation
April 19, 2024
SK hynix has signed an MoU with TSMC for work together on next-generation HBM, with plans to mass produce HBM4 chips from 2026.
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Eindhoven University unveils Future Chips project
April 19, 2024
The Eindhoven University of Technology (TU/e) has announced a major new project to 'boost the position of the Netherlands and Europe in the global chip sector.'
Micron standing by for $6.1bn CHIPS and Science Act package
April 19, 2024
US memory chip specialist Micron Electronics will receive a US government subsidy worth USD 6.1 billion next week, say multiple reports.
Samsung slipped to third place in global top 20
April 18, 2024
According to Omdia's latest report the semiconductor industry experienced a downturn in the market, with 2023 revenues slipping 9% to USD 544 billion compared to 2022. This decline however follows two years of record growth – which only serves to illustrate the cyclical nature of the industry.
Tampere University secures EU funding for semiconductor pilot line
April 18, 2024
On 11 April, the Public Authorities Board of the Chips Joint Undertaking selected four pilot production lines for semiconductor chips that will receive funding from the EU. The selected pilot line in Finland will be set up by Tampere University and the VTT Technical Research Centre of Finland.
Wolfspeed selects Aixtron tools to support 200mm production
April 18, 2024
SiC specialist Wolfspeed has placed multiple-tool orders in Q3 and Q4 2023 to utilise Aixtron's G10-SiC to help further ramp production for 200mm (8-inch) SiC epitaxial wafers.
R2 Semiconductor files lawsuit against Intel in France
April 17, 2024
R2 Semiconductor has filed a patent infringement lawsuit in Le Tribunal Judiciaire de Paris against the French subsidiaries of Intel and its customers, Dell Technologies and Hewlett Packard Enterprise Company and HP Inc.
Quanta Computer to build production facility in Germany
April 17, 2024
Taiwanese Quanta Computer has signed a deal with CTP, a European developer and manager of industrial properties, for a high-tech 22,500 square metre production facility at CTPark Jülich in the Brainergy Park Jülich in northwest Germany.
Exyte acquires Kinetics Group
April 16, 2024
Exyte says it plans to acquire Kinetics Group, a global provider of installation services, equipment, as well as technical facility management.
JDI completes the sale of Higashiura fab to Sony
April 16, 2024
Back in March last year, Japan Display Inc (JDI) announced that it was going to sell its Higashiura fab facilities. The company has now completed the sale of the former Higashiura fab facilities to Sony Semiconductor Manufacturing Corporation (SCK).
Microchip acquires Neuronix AI Labs
April 16, 2024
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
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Microchip secures 40nm manufacturing capacity at JASM
April 12, 2024
US-based chip design firm Microchip Technology has expanded its partnership with TSMC with a new deal to run specialized 40-nm manufacturing at TSMC's subsidiary in Japan.
Siltronic ends wafer production for "small diameters"
April 11, 2024
Siltronic plans to gradually cease production of polished and epitaxial small diameter wafers at its Burghausen site. The process, which excludes unpolished wafers, is set to be completed in 2025.
Microchip acquires VSI
April 11, 2024
Microchip Technology has completed the acquisition of Seoul, Korea-based VSI Co. Ltd., a specialist in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for In-Vehicle Networking (IVN).
Arena team up with AMD
April 11, 2024
AMD and Arena are looking to scale the deployment of the first AI test solution to enhance next-generation GPU performance optimisations.
CSA Catapult opens new advanced packaging facility
April 11, 2024
A new GBP 1.6 million facility to help accelerate electrification across the UK has officially opened at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales.
Taiwan DRAM manufacturers gradually resume production
April 10, 2024
DRAM manufacturers are gradually resuming production following the earthquake that struck Taiwan on April 3, 2024. Despite some damages and the necessity for inspections or disposal of wafers among suppliers, TredForce reports that the impact on the total DRAM output for Q2 is estimated to be less than 1%
Infineon and Amkor looks to strengthen European supply chain
April 10, 2024
Infineon Technologies says that it is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology.
South Korea to spend $6.94bn fighting 'all-out AI war'
April 09, 2024
South Korean President Yoon Suk Yeol has promised to invest 9.4 trillion won (USD 6.94 billion) to keep the country in the global AI race for the next 30 years.
Microchip secures 40nm manufacturing capacity at JASM
April 09, 2024
US-based chip design firm Microchip Technology has expanded its partnership with TSMC with a new deal to run specialized 40-nm manufacturing at TSMC's subsidiary in Japan.
Canada commits CAD 2.4bn to grow its AI sector
April 09, 2024
The federal government of Canada has agreed a financial package to boost the country's AI activity. It includes a new AI Compute Access Fund.
Has Samsung secured an advanced packaging deal with Nvidia?
April 09, 2024
Online reports say Samsung has sealed an advanced packaging order for NVIDIA’s AI processors.
Diamond-based semiconductor startup Diamfab raises EUR 8.7m
April 08, 2024
France-based Diamfab has completed a funding round to accelerate its research into diamond as a replacement for silicon.
Abracon announces senior management changes
April 08, 2024
Texas-based electronic components specialist Abracon has revealed a new leadership structure to prepare itself for future acquisitions.
AI chip specialist Hailo raises $120m
April 08, 2024
Israel-based chipmaker Hailo has completed a new fund raise to bring its lifetime total to $340m since 2017.
WT Microelectronics buys Future Electronics for $3.8bn
April 05, 2024
Taiwan's WT Microelectronics has completed its acquisition of Canada's Future Electronics to create "a global electronic components distribution powerhouse".
Earthquake update: Taiwan's tech sector weathers the storm
April 04, 2024
Taiwan's wafer foundries and DRAM production remains unaffected following the earthquake that struck the island on April 3, 2024.
Hensoldt completes its acquisition of ESG
April 04, 2024
Sensor solutions provider Hensoldt has completed the acquisition of ESG Elektroniksystem- und Logistik-GmbH – which was agreed upon last year – with effect from 2 April 2024.
Helena Maripuu joins Incap as group communication and IR lead
April 04, 2024
As of April 1, 2024, Helena Maripuu has joined the headquarters and team of EMS provider Incap to take the lead in managing processes for Group communication and Investor Relations.
Cicor completes the acquisition of TT Electronics IoT Solutions
April 04, 2024
EMS provider, the Cicor Group has completed the acquisition of TT Electronics IoT Solutions Ltd. with three production sites in the UK and China.
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