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Mobis starts construction of new EV battery plant in Spain
April 25, 2024
Auto parts maker Hyundai Mobis is starting the construction of a new plant in Spain. The new electric vehicle battery system plant will serve as a dedicated facility supplying Volkswagen.
Toradex acquires Linear Computing
April 25, 2024
Embedded systems specialist Toradex announces that it has acquired Linear Computing Inc. (LCI).
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Mycronic receives order for a Prexision 80 Evo
April 25, 2024
Swedish Mycronic has received a replacement order for a Prexision 80 Evo from an unnamed, but existing customer in Asia.
China beefs up its chip production – grew 40% in 1Q24
April 25, 2024
Backed by official support and continued industry investments, China's total chip production reportedly surged by 40% during the first quarter of 2024 – reaching 98.1 billion units.
TTM Technologies invests in Inovaxe’s SREX Racks
April 25, 2024
During the recent 2024 IPC APEX Expo TTM Technologies chose to invest SREX Racks from Inovaxe, directly off the show.
Nokia's OLT cards are rolling off the production line at Sanmina
April 25, 2024
Nokia's first Buy America-compliant products have rolled off the Sanmina manufacturing line at the EMS providers facility in Kenosha County, Wisconsin.
SK Hynix to invest $3.86B in DRAM production in South Korea
April 24, 2024
SK hynix says that it plans to expand production capacity of the next-generation DRAM, including HBM, in response to the rapidly increasing demand for AI semiconductors.
Thales expands production at its site in Arnstadt
April 24, 2024
In an update, Thales says that expanding its circuit board production at the transport site in Arnstadt, Germany.
DigiKey and 3PEAK establish global distribution partnership
April 24, 2024
DigiKey has expanded its product portfolio through a strategic global distribution partnership with 3PEAK, a high-performance developer of semiconductor technology.
Converge achieves ISO/IEC 17025:2017 and AS6171 accreditations
April 24, 2024
Converge, an Arrow company, has it received ISO/IEC 17025:2017 accreditation including AS6171 general requirements and applicable slash sheets.
Thomas Gottwald takes on the role of CTO at Schweizer
April 24, 2024
The Supervisory Board of Schweizer Electronic AG has appointed Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of years with effect from 1 May 2024.
Scanfil is gearing for future growth
April 24, 2024
Turnover took a hit during Scanfil's first quarter and decreased 11.5%. The EMS provider faced lower market demand compared to last year and the focus was therefore on improving operations and protecting the operating margin.
From Fusion to Chip 1 Exchange – Behzad Monfared joins as EVP
April 23, 2024
Global distributor of electronic components, Chip 1 Exchange, is expanding its leadership team with the addition of Behzad Monfared as Executive Vice President.
Vishay selects Aixtron SiC multiwafer batch technology
April 23, 2024
Aixtron's G10-SiC epitaxy production platform has been chosen by Vishay Intertechnology, to empower the company’s in-house SiC epitaxy needs for power device manufacturing.
Trymax receives multi-system orders from Asian foundry
April 23, 2024
Trymax Semiconductor Equipment (Trymax), a provider of plasma solutions, has received multi-system orders for its NEO 2400 series and NEO 2000UV from an unnamed large Asia-based foundry.
ZF opens automotive technology center in Mexico.
April 23, 2024
Mobility technology company ZF has officially opened the campus that will house four corporate function hubs for North America and the company's first R&D center in Monterrey, Mexico.
UCT opens new manufacturing facility in Malaysia
April 23, 2024
Ultra Clean Holdings, Inc. (UCT), has officially inaugurated its new manufacturing facility in Pulau Pinang. The new facility represents an investment of MYR 250 million (about EUR 49 million).
Silicon Creations hits milestone of 10 million wafers in production with TSMC
April 23, 2024
Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.
AI demand drives growth in QLC enterprise SSD shipments
April 23, 2024
North American customers are increasing their orders for storage products as energy efficiency becomes a key priority for AI inference servers.
Contac Solutions acquire Weka kabelkonfektion
April 23, 2024
Swedish Contac Solutionn acquires Weka Kabelkonfektion GmbH in Lilienthal outside Bremen, Germany. Weka has a long history of manufacturing cable harnesses and has for several years had a collaboration with Contac.
Rohde & Schwarz opens new facility in India
April 23, 2024
On April 22, Rohde & Schwarz inaugurated a new facility centre in Bengaluru’s Manyata Tech Park, housing R&D, system integration as well as calibration and repair services.
Festo and Phoenix Contact enter technology partnership
April 23, 2024
Festo, manufacturer of pneumatic and electrical automation technology, will use PLCnext Technology, the open ecosystem for automation from Phoenix Contact, in future intelligent devices.
Renesas share impact of the April 17 earthquake
April 23, 2024
A magnitude 6.6 earthquake, measuring a weak 6 on Japan’s seismic intensity scale, struck off the west coast of Shikoku island on April 17.
Is Goldene the new semiconductor wonder material?
April 22, 2024
Researchers from Linköping University have developed a material made from a single atom layer of gold, which could transform chip manufacture.
Toshiba to axe 5,000 jobs as re-structure continues
April 22, 2024
Japan's Toshiba Corp is reported to have cut its staff count by 5000 – that's 10% of the total – as it tries to streamline its operations as a private company.
Unnamed firm buys world's second High-NA EUV machine
April 22, 2024
ASML has disclosed that it has shipped a second Extreme Ultraviolet Lithography (EUV) machine, but it hasn't named the customer.
Infosys to acquire German automotive engineering firm
April 22, 2024
India's Infosys has reached an agreement to purchase in-tech, a provider of engineering R&D services to the automotive, rail and smart industry sectors.
Malaysian government unveils new semiconductor strategy
April 22, 2024
Malaysia's Ministry of Investment, Trade and Industry (MITI) says it will draw up a comprehensive Semiconductor Strategic Plan to make the country an attractive destination for chip makers.
LEM Holding opens its first manufacturing plant in Penang
April 22, 2024
Switzerland-based electrical measurement company LEM has started production at a new 11,800 square metre facility in Penang Science Park, Malaysia.
State-backed fund takes over photoresist specialist JSR
April 22, 2024
The Japanese government and the state-backed Japan Investment Corp (JIC) have acquired a majority stake in JSR.
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