400 attended Rehm Technology Days

Rehm had invited people from the electronics manufacturing across the whole Europe. Over 400 attended the seminars and workshops arranged by Rehm and its partners. Two live production lines, one with a Rehm Condenso Batch and one with a reflow oven, had been established together with Rehm's partners Siemens Siplace, Viscom, Juki, ASYS and Ekra. Andreas Schlipp from Würth Elektronik held a presentation about new technologies within the flex-rigid PCB technology, Dr. Friedrich-Wilhelm Wulfert at Freescale held a presentation about the temperature issues in soldering leadframe and encapsulant components. Thomas Lehmann at Christian Koenen showed that he thinks his stencils, who are laser cut, have several benefits compared to the etched counterparts. Rosella Silvani at Solvay Solexis presented the company's products within the vapour phase soldering technology. Dr. Hans Bell finished the seminar round by comparing the two soldering technologies vapour phase soldering and reflow soldering but just before Dr. Max Poech at the FhG ISIT institute in Itzehoe showed the meanings of different kinds of temperature profiles in reflow soldering. Click here to see the pictures from the event.