Amicra gets new order from telecom company in China

The order calls for several of Amicra’s AFC Die Bonder / Flip-Chip Bonder Systems for extremely high-precision bonding offering a placement accuracy of +0.5 µm at 3 Sigma. Amicra Managing Director Dr. Johann Weinhaendler stated: “We at Amicra Microtechnologies are very happy about the new order coming from an important user market of ours. We are looking forward to an excellent customer partnership with a major corporation.” The AFC bonders will be used in the packaging of optical devices at the Chinese customer's facility.”