New Head for engineered solder materials at Induim

Jensen is responsible for Indium product group of solder preforms, wire, ribbon, and foil, as well as thermal interface materials. He is responsible for the overall success of the product line, including sales volume, profitability, the range of products, and Indium Corporation’s strategic approach to the market. He is based at Indium Corporation’s facility in Clinton, N.Y. Jensen joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, product manager for PCB assembly materials.