Ad
Ad
Ad
Ad
Ad
Ad
Ad
SMT & Inspection | March 03, 2006

Siemens take over the die bonder department from F&K Delvotec

Siemens Electronics Assembly Systems has acquired the die bonder business at F&K Delvotec.

The R&D department, the manufacturing and the service and consulting business will now be a part of the Siemens Electronics Assembly's optical solutions department.
Ad
Ad
Load more news
June 17 2019 9:26 pm V13.3.21-1