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SMT & Inspection |

Siemens take over the die bonder department from F&K Delvotec

Siemens Electronics Assembly Systems has acquired the die bonder business at F&K Delvotec.

The R&D department, the manufacturing and the service and consulting business will now be a part of the Siemens Electronics Assembly's optical solutions department.

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April 15 2024 11:45 am V22.4.27-1
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