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Electronics Production | October 25, 2005

Discovering Gold as<br> a Lead-free Substitute

When looking at Lead-free alternatives Gold-stud bumping is named as a cost effective alternative to older bumping technologies, evaporation and electroplating.

The looming lead-free debacle is driving desperate alternative seekers to find proven lead-free flip chip bumping technologies. The leading candidate is gold bumping, which has a long history of high-volume production. You can read more about this technology at Advanced Packaging
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