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Electronics Production | February 17, 2011

SMSC's ICC technology licensed by Qualcomm

Qualcomm has licensed SMSC's patented Inter-Chip Connectivity (ICC) technology.

The High Speed Interconnect (HSIC) specification (an addendum to the USB 2.0 specification) includes the ICC technology. Where applicable, such as in portable applications, the ICC technology decreases power consumption and silicon area compared to an analog USB 2.0 interface, the press release states. Using its ICC license with SMSC, Qualcomm can develop devices that are compliant with the HSIC specification for both USB 2.0 host and USB 2.0 device applications.
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