SMT & Inspection |
EV Group secures order from Sematech
EV Group has announced that Sematech has selected EVG's fully automated 300-mm Gemini wafer bonder for enabling next-generation TSV and 3D interconnects.
The EVG system will be installed in Sematech’s 3D R&D Center at the College of Nanoscale Science and Engineering's Albany NanoTech Complex in Q4 2009.
With the rising demand for smaller, more functional and lower-power chips, 3D architecture is emerging as the clear approach for meeting consumer device requirements.
"SEMATECH has been involved in 3D research for several years, and we are committed to building a strong infrastructure to pave the way for volume production of TSVs," noted Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "Wafer and die bonding are key processes for 3D interconnects, and the EVG wafer bonding technology will provide various bonding capabilities that allow our researchers to aggressively address technical challenges in bonding next-generation TSVs, a critical requirement for successful introduction of 3D interconnects."
