© mariusz szachowski dreamstime.com Business | January 18, 2019
Rudolph Technologies receives order from major memory manufacturer
Rudolph Technologies, announces that it has received orders for over USD 15 million of legacy and new process control systems from an unnamed memory manufacturer based in Asia.
The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packaging architectures. The shift from wire bonding is needed to achieve higher data speeds, superior power distribution and thermal properties using copper pillars, micro-bumps, and through silicon vias (TSVs) for stacked chip-to-chip interconnects. Delivery of systems will be completed by the end of the first quarter, with additional orders expected throughout 2019 as memory manufacturers transition their high-speed DRAM from wire-bonded architecture to advanced packaging, Rudolph Technologies states in a press release. “Rudolph began working with our customers’ R&D teams nearly ten years ago to develop 2D/3D measurements of the emerging copper bump process. That long-term customer engagement has resulted in systems and software that we believe to be the industry standard for advanced packaging metrology,” says Cleon Chan, vice president of global field operations at Rudolph. “Stacking die using TSVs and micro-bumps for HBM DRAM packages requires precise control of the copper features that will ultimately make the electrical connections between the stacked memory chips and the logic chip in the same package. After significant development in the package and the process control methods, these devices are now beginning high-volume manufacturing, which is being driven by the data speed and capacity demands from big data servers and graphics applications. These new, non-wire bonded memory architectures are creating a very healthy demand for our back-end process control systems. This customer is also using Rudolph systems for post-saw film-frame inspection looking for package defects,” Chan continues.
Walsin restarts production at resistor plant in Malaysia The manufacturer was forced to temporarily shut down production at the plant in late November to facilitate coronavirus-related inspections.
Siltronic moves into new HQ in Munich As we entered December, the German wafer manufacturer moved to its new headquarters in the Bavaria Towers in Munich, Germany.
Infineon plans to make Singapore its global AI innovation hub The German chip-giant is celebrating its 50th anniversary in Singapore announcing plans to make the country its AI innovation hub as it moves forward with its digital transformation.
Transphorm choses Veeco system for GaN-based power and 5G devices Veeco Instruments says that Transphorm, a supplier of gallium nitride (GaN) products for high voltage power conversion applications, has selected its Propel HVM MOCVD System for high-volume production of GaN-based RF (DoD and Commercial/5G) and power electronics Epiwafers.
TTI denies Chinese military ties by its Hong Kong subsidiary The specialty distributor is denying that it’s Hong Kong subsidiary has any ties to Chinese military following the Bureau of Industry and Security (BIS) naming the Asian unit in a draft rule.
ECD Launches SelectiveRIDER™, Closes the Loop on Automated Soldering Solutions ECD announced the addition of SelectiveRIDER™ to its portfolio of soldering process measurement pallets, effectively closing the loop to deliver a complete line of automated verification technologies for every machine soldering process: wave, reflow and selective.
All That Glitters Is Not Gold! Application engineers often repeatedly answer the same questions from different customers, especially queries related to the selection of parts in their application. One mistake we see in part selection happening time and time again is that the customers become over enamored by what I like to call “the sheet” in data sheets.
Infineon extends franchise sales agreement with Future Electronics Future Electronics can now sell both the Infineon and the Cypress portfolios of products to customers across the Europe, Americas and Asia regions
Private equity firm acquires Evans Capacitor Company Arcline Investment Management has acquired the Rhode Island based manufacturer of high energy density capacitors.
Diodes completes its acquisition of Lite-On Semiconductor Diodes Incorporated has completed its close to USD 450 million acquisition of Lite-On Semiconductor (LSC).
Toshiba says it's not negotiating with UMC Toshiba Electronic Devices & Storage Corporation states that despite certain media reports, the company is not selling two of its fabs to Taiwanese United Microelectronics Corporation.
NVIDIA acquires Swedish VCSEL startup On the heels of the GPU-giant’s massive USD 40 billion acquisition of ARM – which was just made official back in September – comes yet another acquisition; though this time at a much smaller scale.
Analog Devices ends its fiscal year 2020 on a high Fourth quarter revenue came in at USD 1.53 billion, above the high-end of the company’s outlook.
GlobalWafers confirms takeover discussions with Siltronic The Taiwanese company says it is in advanced, near to final discussions on a takeover offer of German supplier of silicon wafers, Siltronic AG.
Covid-19 halts Chinese SK Hynix plant The discovery of an asymptomatic, but infected, employee brought SK Hynix’s plant in Chongqing, China to a halt on Sunday.
Murata to shut down Chinese production facility Saitama Murata Manufacturing, a subsidiary of Murata, will close its its coil production subsidiary Sheng Long TOKO Tech, located in Shenzhen, China, during December 2020
Antistat™ launch new product range of ESD Anti-fatigue matting Manufactured in the EU, Antistat’s new range of matting blends exceptional quality with durability offering a life span of up to 5 years.
Digi-Key inks new U.S. distribution partnership with MISCO Digi-Key Electronics has expanded its product portfolio to include a U.S. distribution partnership with MISCO, a resource offering complete audio solution services.
Arkema kickstarts capacity increase of fluoropolymer in China Arkema is starting up its 50% capacity increase of Kynar fluoropolymer for the lithium-ion battery business at its Changshu plant in China in December 2020, with the first commercial supplies for January 2021.
STMicro and YTO set up joint lab for smart agricultural equipment Semiconductor manufacturer STMicroelectronis, is teaming up with Chinese provider of agricultural and construction machinery YTO Group to establish a joint lab which will focus on R&D of electronic solutions for engine, vehicle, and agricultural controls in tractors.
12 new 1200V Hyperfast and Ultrafast Rectifiers from Vishay New Yorker Electronics has announced the availability of 12 new FRED Pt® Gen 5 1200 V Hyperfast and Ultrafast rectifiers from Vishay Semiconductor. The ideal choice for soft switched and resonant high frequency converters, it features a unique combination of low conduction and switching losses.
SKT's new AI chip changes the company's AI semiconductor business vision SK Telecom (SKT) has unveiled its new, self-developed, AI chip named SAPEON X220; a chip that, according to the company, will alter the company's AI semiconductor business vision.Load more news