© mariusz szachowski dreamstime.com Business | January 18, 2019
Rudolph Technologies receives order from major memory manufacturer
Rudolph Technologies, announces that it has received orders for over USD 15 million of legacy and new process control systems from an unnamed memory manufacturer based in Asia.
The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packaging architectures. The shift from wire bonding is needed to achieve higher data speeds, superior power distribution and thermal properties using copper pillars, micro-bumps, and through silicon vias (TSVs) for stacked chip-to-chip interconnects. Delivery of systems will be completed by the end of the first quarter, with additional orders expected throughout 2019 as memory manufacturers transition their high-speed DRAM from wire-bonded architecture to advanced packaging, Rudolph Technologies states in a press release. “Rudolph began working with our customers’ R&D teams nearly ten years ago to develop 2D/3D measurements of the emerging copper bump process. That long-term customer engagement has resulted in systems and software that we believe to be the industry standard for advanced packaging metrology,” says Cleon Chan, vice president of global field operations at Rudolph. “Stacking die using TSVs and micro-bumps for HBM DRAM packages requires precise control of the copper features that will ultimately make the electrical connections between the stacked memory chips and the logic chip in the same package. After significant development in the package and the process control methods, these devices are now beginning high-volume manufacturing, which is being driven by the data speed and capacity demands from big data servers and graphics applications. These new, non-wire bonded memory architectures are creating a very healthy demand for our back-end process control systems. This customer is also using Rudolph systems for post-saw film-frame inspection looking for package defects,” Chan continues.
Digi-Key inks distribution partnership with Siglent Technologies Digi-Key Electronics has expanded its product portfolio by signing a North American distribution partnership with Siglent Technologies, providing its customers with electronic test and measurement solutions.
Jenoptik supplies infrared optics to Rheinmetall The photonics group Jenoptik will supply infrared optical components to Rheinmetall between 2020 and 2025.
Kyoto Semiconductor names new president and CEO As of April 1, 2020, the company has announced that a new management system will begin, with Tsuneo Takahashi set to become its new President and CEO.
Smoltek signs evaluation license agreement with capacitor manufacturer Swedish technology company, Smoltek, says that it has signed an evaluation agreement with an unnamed manufacturer of capacitors.
Pervasive Displays increasing manufacturing capacity e-paper display manufacturer, Pervasive Displays (PDi), says it has made a major advancements in product reliability and manufacturing capacity to improve the automated production of electronic paper displays (EPDs).
Analog Devices prioritises the medical field during pandemic Analog Devices, Inc. has taken a series of actions to support the global response to the COVID-19 pandemic by expediting production of its healthcare technologies that can help fight the outbreak.
Autec Power Systems & New Yorker Electronics inks agreement Autec Power Systems, a provider of custom power supplies, high-efficiency LED Drivers, switching power supplies and power management products, has signed accredited distributor New Yorker Electronics to a new distribution pact.
MagnaChip Semiconductor to sell its foundry business and Fab 4 MagnaChip Semiconductor says that certain of its wholly-owned subsidiaries have entered into a definitive agreement to sell the company's Foundry Services Group and the factory in Cheongju (Fab 4), the larger of the company's two 8" manufacturing facilities.
Singulus Technologies temporarily reduces business operation Against the backdrop of the current situation related to the spread of COVID-19 and the resulting restrictions in private and business lives, Singulus Technologies is implementing short-time work at two of its German sites.
Kyocera to acquire Japan-based Showa Optronics Kyocera Corporation has entered into a share transfer agreement with NEC Corporation on March 25, 2020 to acquire all of NEC’s shares in Showa Optronics Co., Ltd., an optical components manufacturer.
Analog Devices withdraws second quarter outlook The economic and social effects caused by COVID-19 are currently creating supply chain disruption and uncertainty around future demand.
Movement control order restricts production for Renesas in Malaysia Due to a Movement Control Order announced by the Malaysian government, Renesas three production sites located in the country temporarily halted productions from March 18, 2020.
TTI remains operational during COVID-19 pandemic TTI, Inc. says it remains open following the guidelines mandated by local and federal governments during the COVID-19 coronavirus outbreak, with precautions in place to safeguard employees’ health.
Nokia completes acquisition of Elenion Technologies Nokia says it has completed its acquisition of U.S.-based supplier of silicon photonics technology, Elenion Technologies.
Nexperia CEO Frans Scheper retiring On March 24, 2020, Nexperia announced that CEO Frans Scheper has decided to take early retirement and will step down as Nexperia CEO and Management Board Member per March 25, 2020.
Intellitronix seeing interest from Ford Ohio-based Intellitronix Corporation, a subsidiary of US Lighting Group, has been invited by the Ford Motor Company to submit a proposal to design and manufacture an automotive electronics component for one of the automaker’s upcoming vehicles.
NEXT Biometrics receives additional order from government program in India NEXT Biometrics has received an additional order for UIDAI and STQC certified fingerprint biometric readers in India valued at USD 360,000. The customer has provided a 20% upfront payment and the readers have been delivered to the customer.
Elmos is planning short-time work Because of the global corona pandemic, Elmos Semiconductor AG is planning to introduce short-time work of up to 50%.
paragon reacts to production stoppages by carmakers paragon is set to take immediate action in response to moves by automotive manufacturers closing down their plants. The company is now reducing production at its automotive manufacturing sites in Germany to a minimum for the time being.
STMicro to temporarily cut 50% of French production The semiconductor company has reportedly agreed to temporarily reduce its production in France by up to 50% as the company works to stymie the spread of COVID-19.
The Infineon site in Villach is growing Infineon’s investment in a new automated chip factory and a research building at its site in Villach is making progress.
Panasonic eyes multi-use potential for PanaCIM Panasonic, in their push more deeply into smart manufacturing solutions, has partnered with MiR and Inovaxe to develop a handy helper: the PanaCIM Solutions Ecosystem.Load more news