© eRamp / Infineon
Components |
'eRamp' strengthens Europe in power electronics
One of the most important European research projects for energy efficiency, 'eRamp', is coming to a close. Over the past three years, 26 partners from business and science have explored innovative electronics components for using energy even more efficiently.
Their focus was on the rapid introduction of new production technologies, such as packaging technologies for energy-saving chips. The eRamp project covered the entire power electronics value chain, from generation and transmission all the way to consumption. Infineon, the world market leader in power semiconductors, led the research, which was conducted in six European countries. The project strengthens Germany and Europe as centers of expertise for power electronics.
“The eRamp results have created the prerequisites for keeping the production of power electronics in Europe competitive,” said Dr. Oliver Pyper, Senior Manager of Research, Development and Innovation Programs at Infineon Technologies Dresden and the eRamp project coordinator. “Power electronics guarantee an ever more efficient generation, transmission, and use of electric energy. And it is in this area that eRamp has significantly expanded our expertise in Europe.”
The research results were tested for practical viability directly in the semiconductor production environment. The research partners used existing pilot lines and comprehensive production expertise at five sites:
- Dresden, Germany and Villach, Austria (power semiconductors based on 300mm wafers; Infineon)
- Regensburg, Germany (chip packaging technologies for power semiconductors; Infineon)
- Reutlingen, Germany (power semiconductors, smart power and sensors based on 200mm wafers; Bosch)
- Unterpremstaetten near Graz, Austria (3D/TSV pilot line; ams)