ZoneBOND technology makes foray into compound semi market

This order marks the first implementation of ZoneBOND TB/DB technology in the manufacture of compound semiconductors. "The compound semiconductor market has always been a front runner in driving the introduction of new temporary bonding/debonding technologies - starting from solvent-assisted debonding, tape debonding, slide off debonding and now ZoneBOND," noted Dr. Thorsten Matthias, business development director for EVG.