Components | June 14, 2012
AMD signs technology partnership with ARM
Through a strategic technology partnership with ARM, AMD will integrate the established ARM TrustZone technology into future Accelerated Processing Units (APUs) via a system-on-a-chip (SoC) design methodology.
AMD plans to provide development platforms that have TrustZone security features on select APUs in 2013, expanding further across its product portfolio in 2014. In a presentation this week at the AMD Fusion Developer Summit 2012 (AFDS), AMD Senior Vice President and Chief Information Officer Mike Wolfe described AMD’s vision to advance computing security by enhancing AMD’s existing security technologies. This is expected to include developing a platform security processor using an ARM Cortex-A5 CPU that features TrustZone technology, to monitor and help protect against malicious access to sensitive data and operations at the hardware level. “With AMD’s support for, and inclusion in, the expanding TrustZone ecosystem, consumers and businesses can rest assured their data and content are secured by an industry-standard security solution that spans a multitude of devices and operating systems,” said Wolfe. “This example of AMD’s ambidextrous strategy, which leverages our history of x86 and graphics innovation while also embracing other technologies and intellectual property, will help drive a more secure computing experience for our consumer and businesses customers.” “As technology becomes more important to our everyday lives, security needs to be present in every single device. The challenge that the industry faces is how to make this a reality,” said Ian Drew, executive vice president, strategy, ARM. “Through this technology partnership with AMD, and the broadening of the ARM TrustZone technology ecosystem, we’re making another important step towards a solution. The aim is to make security accessible and consistent for consumers and business users across all computing devices.”
Cooperation between Elmos and Fraunhofer Institute IMS comes to an end The cooperation between Elmos Semiconductor AG and Fraunhofer Institute for Microelectronic Circuits and Systems (IMS) in Duisburg will end on June 30, 2020 in accordance with the agreed contract period, despite Elmos wishes to continue.
Exxelia picks up Micropen Technologies Exxelia, a Paris-headquartered designer and manufacturer of high-rel passive components and sub-systems for extreme environments announced the completion of its late-2019 acquisition of Micropen Technologies Corporation.
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Camtek receives orders for 34 systems from five manufacturers Camtek says it has received orders for 34 systems for 2D inspection of CMOS image sensors from five different manufacturers, of which 25 are from two customers.
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NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
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Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
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Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.Load more news